CMP

study on kinematic mechanism of rotary cmp equipment with single head

单头单面旋转式化学机械抛光机的运动机理研究

cmp has become the mainstream of the market.

CMP已经成为市场的主流，对CMP处理芯片的研究也成为了必要。

estimation of quality factor from cmp gathers and its application

共中心道集中品质因子的估计及应用

analysis of influencing factors of sapphire substrate cmp removal rate

蓝宝石衬底材料CMP去除速率的影响因素

dependency of material removal rate on velocity in cmp of microelectronic materials

微电子材料CMP加工中去除率与速度的关系

A Study on Mechanisms for Chemical Action of Tungsten Plug in CMP

钨插塞在化学机械抛光中的化学作用机理研究

study of computer hard disk substrate and its cmp

计算机硬盘基板及其CMP技术分析研究

factors influencing the generation rate of oxidized layer on wafer surface in cmp

CMP过程芯片表面氧化膜生成速度影响因素的分析

refraction seismic interpretation method in cmp domain and its application case

共中心点域浅层折射波解释方法及应用实例

applying cmp technology improves agility and efficiency of enterprise management information system.

应用CMP技术提高了企业信息化系统应用的敏捷性和高效性。

study on treatment technology of cmp effluent

化学机械浆废水处理技术探讨

parallel computing tasks allocation of the cmp system

一种面向多核系统的并行计算任务分配方法

Design and Implementation of BCI Parallel Algorithm on CMP

基于CMP的脑机接口并行算法的设计与实现

research on pulping, bleaching and paper making of poplar cmp

杨木CMP的制浆漂白和配抄的研究

the characteristics of the processor make it suitable for the core of cmp.

上述优点使该处理器内核经过裁减非常适合作为单芯片多处理器的内核。

However, Dain Sundstrom has been busy closing issues, including initial implementations of the automatic schema creation for CMP.

但是，Dain Sundstrom已经在忙于解决问题，包括为CMP自动创建模式的初始实现。

Zone Back pressure Control Using for Vacuum Carriers in CMP

CMP加工中的真空吸盘区域压力控制技术

research on cmp load balancing scheduling algorithm based on hypercube structure

基于超立方体结构的CMP均衡调度算法研究

post cmp cleaning technology in the fabrication of integrated circuits

集成电路制备中化学机械全局平面化（CMP）后的表面清洗技术

air distribution and microenvironment evaluation of cmp desktop task air conditioning

CMP桌面工位空调的气流组织与微环境评价

research progress of cmp technology in ultra-precision surface of single-crystal silicon

用于超精密硅晶片表面的化学机械抛光（CMP）技术研究

study on cmp effluent and its treatment by an integrated process

混合材CMP废液综合治理技术的研究

effect of barrier slurry properties on post cmp cleaning efficacy

阻挡层浆料特性对CMP后清洗效力的影响

based on the research results, the material removal mechanisms of copper cmp were analyzed.

根据现有的研究成果主要介绍了铜化学机械抛光的化学材料去除机理；

A New Method to Code Non-circle Molecules: CMP Algorithm

对无环分子编码的一个新方法：CMP法

study on cmp technology of single crystal mgo substrates for high temperature superconductors

单晶MgO高温超导基片CMP工艺的研究

properties of surface oxidation film in cmp of computer hard disk substrate

计算机硬盘基片CMP中表面膜特性的分析研究

treatment of kenaf cmp with hot water and organic solvent

红麻化机浆漂前热水处理和漂后有机溶剂洗滤

Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.

为模拟cmp磨料 分配系统的粒子减少开发了数字模型.

nowadays, cmp technology has been widely used in ulsi manufacturing.

目前，CMP技术已成为ULSI时代最广泛使用的平坦化技术。