bga

Assembly of Advanced packages such as Ball Grid Array ( BGA ) and Chip Size Package ( CSP ).

先进封装的装配,如球形焊点阵列和芯片尺寸封装.

A shadow moire technique by changeable light source for BGA coplanarity measurement

BGA引脚共面度的变光源阴影莫尔测量技术

It avoids PCB crooked or BGA blister from traditional technology of centralizing heating.

优化直向加热的传统技术,防止局部超高温而使线路板跷曲或BGA起泡 等不良影响,有效保护拆焊组件及线路板.

Due to the special form of BGA package, enough care must be taken when PCBs are wired in order to re-duce the short risk during soldering.

由于BGA封装的特殊形状，为减少焊接时短路的风险，在PCB布线时必须此起足够的注意。

Application of Infrared Heating Technology to BGA Rework Soldering Center

红外加热技术在BGA返修焊接中心的应用

Influence of Spheroidization Temperature on Quality of BGA Solder Ball

球化温度对BGA钎焊球质量的影响

Desirable for high-performance Ball Grid Array ( BGA ) package .

高性能球形焊点阵列封装需要 倒装焊.

The fact that BGA could influence the effect of FA HDL was attributed to the properties of BGA and the photosynthetic characteristics of E.

BGA对FA旱地龙作用效果的影响原因可能与BGA和植物本身的光合特性有关。

BGA rework process is analyzed by PBGA and CBGA practical rework process to rapid BGA rework quality.

以PBGA和CBGA为例，结合实际返修过程中的经验，对返修过程中应注意的问题进行分析，以提高BGA的返修质量。

Unique a 3 segments'temperature curve program achieves a stage heating with good protection of BGA.

独设三段式温度曲线程序,实践分段升温控制,令BGA得到妥贴的保护.

Defect Analysis and Process Improvement of BGA Solder Joint

BGA焊点的缺陷分析与工艺改进

Application of Fuzzy-PID in the Temperature Control System of BGA Rework Station

模糊PID在BGA返修站温度控制中的应用

Application of ESPI in Solder Ball Failure Test on Board-Level BGA Package

ESPI在板级BGA封装器件焊球失效检测中的应用

In large scale integrated chip field, the IC of BGA encapsulation was widely used.

在大规模集成芯片中以BGA( 球栅阵列)封装的IC芯片被广泛使用.

Mechanical Test and Analysis on the Reliability of Lead-Free BGA Packaging

无铅BGA封装可靠性的力学试验与分析

Study on the degradation of acidic blue BGA by photocatalytic oxidation based on microwave electrodeless UV lattice

微波无极紫外点阵光催化氧化降解酸性蓝BGA的研究

This technique has been successfully applied in the dimensional measurement of BGA chip leads.

此技术已成功应用于BGA芯片管脚的三维尺寸测量中.

This phenomenon indicates that the strength of the IMC layers which connect the BGA and bonding pad is increased by adding nanoparticles.

这说明了钎料与焊盘连接处的IMC的强度在添加纳米颗粒后得到了明显的提高。

The experimental results show that this method is simple, which not only overcomes the disadvantages of normal alarm correlation ways, but also improves the dynamic character, training accuracy and efficiency greatly than BP algorithm, BGA algorithm and AGA algorithm do.

实验表明，这种方法可克服一般告警相关性分析方法的局限，不仅简单，而且在网络学习和训练效率上也高于传统的BP算法，标准遗传算法和一般的自适应遗传算法。