bonding material

The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage.

晶圆键合机的基本原理是对需要键合的材料施加一系列的外部条件，比如压力、温度、环境、电压，不同的外部条件可以用来进行不同材料和结构的键合。

Using modern testing techniques such as XRD, SEM, EDS, EPMA, DSC to study the material composition, preparation process, microstructure and properties, and the mechanism of thermal shock and bonding mechanism were explored.

利用XRD、SEM、EDS、EPMA、DSC等现代测试技术研究了材料组成、制备工艺、结构与性能的关系，探讨了材料抗热震机理和粘结机理。

Applying a photopolymer resin instead of thermopolymer resin as a bonding material, a rapid manufacturing of grinding wheel is realized on the basis of rapid prototyping.

将光固化树脂代替热固化树脂作为结合剂，利用快速成型原理实现了砂轮的快速制造。

Bonding material of aluminum and copper is useful material concerning lightening, and thermal and electrical conductivity.

粘结材料的铝和铜是关于减轻了有用的材料, 和热和电导率.

Alkali-activated metakaolin adhesive agent is a new kind of bonding material.

碱激发偏高岭土粘结剂是一种新型材料.

Suitable for glass, aluminum material, stone, concrete, brick, ceramic, plastic, non-structural bonding and sealing.

适合于玻璃, 铝材, 石材, 混凝土, 砖瓦, 陶瓷, 塑料间的 非 结构性粘结密封.

A high strength insulating brick with high alumina and low iron oxide has been developed by using floating particles and bonding clay as starting material with expanding agents, flux and combustible additives.

以漂珠、结合粘土为原料，加入膨胀剂、助熔剂和可燃加入物.可制得高强、高铝、低铁隔热耐火砖。

Bonding material not present if required.

在有要求时，却没有粘贴物质。

Technique, such as electronic probe, XRD, optical microscope, micro-hardness and macro hardness test, are applied to investigate the microstructure, phase structure, and analyze the alloy element distribution of metallurgical bonding layer and the material mechanical property changes.

利用电子探针、XRD、光学显微镜、显微硬度和宏观硬度测试等手段，研究扩散件试样的显微组织、物相结构，分析冶金结合层中合金元素分布和材料内部力学性能变化。

Objective To discuss the utilization of Super Bond C& B bonding material in the post crown of anterior teeth with bad root canal shape and structure.

【目的】探讨Super bond C&B粘接材料在根管形态或结构不良的前牙桩冠修复中的运用。

Selection of the underlying bonding material generally chromium iron-nickel alloy.

粘接底层材料一般选用铬铁镍合金。

Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

Sticky carbon fiber reinforcement: matching bonding material is used, carbon fiber paste it into the concrete structures on the surface of a reinforcement method.

粘碳纤维加固：是采用配套粘接材料，将碳纤维材料粘贴到混凝土构件表面上的一种加固方法。