Packaging Test的例句大全

SPIL ChangHua now offers a wide range of packaging and test services, ranging from matured leadframe packages to advanced substrate based packages.

新竹分公司由新竹一厂、新竹二厂、新竹三厂及介寿行政中心组成，提供客户最先进的测试解决方案。

Packaging Cushioning materials Test method for creep properties

GB/T14745-1993包装缓冲材料蠕变特性试验方法

Packaging Food Weighing Test Technology Review

袋装食品包装称重检测技术进展

Based on the data of packaging product dropping test and the shock spectrum, a new method is presented to determine the fragility of packaging products under complex excitation by the two index of critical acceleration and critical displacement.

以产品跌落试验实测数据为依据，讨论了一种基于易损零件冲击谱，用临界加速度和临界位移两个指标确定产品易损性的新方法。

Updating The Packaging Dynamic Model Using Test Data

实验结果修正理论在包装动力学建模中的应用研究

Dry electrodes of different forms of packaging to suit different test environment are achieved.

对干电极进行了不同形式的封装以适应不同的测试环境。

Along with the development of modern design and packaging technology, external test can't meet the needs.

随着现代设计和封装技术的发展，外部测试变的越来越不适应。

Packaging packing containers Air-tight test method

GB/T17344-1998包装包装容器气密试验方法

The inner receptacle of a composite packaging or IBC may be tested without the outer packaging, provided the test results are not affected.

如试验结果不会受到影响，复合容器或中型散货箱的内贮器可在不用外容器的情况下进行试验。

packaging - transport packages - sinusoidal vibration test method at constant frequency

正弦定频振动试验方法

packaging - basic tests for transport packages - part 7 : sinusoidal vibration test method at constant frequency

包装运输包装件基本试验第7部分：正弦定频振动试验方法

packaging - transport packages - sinusoidal vibration test method using a variable vibration frequency

正弦变频振动试验方法

knowledge of product packaging design, assembly and test processes, statistical methods, project management;

拥有产品包装设计、装配及测试流程、统计方法及项目管理知识；

every packaging intended to contain liquids shall successfully undergo a suitable leakproofness test.

拟装液体体的每个容器，必须在下列情况下成功地通过适当的密封性试验。

remove the sight control circuit packaging intact were the high-low temperature impact test;

将瞄准镜控制电路取下，包装完好分别进行高低温环境冲击试验；

wafer-level ic test probe card is mainly used in the test of chips electric characters before packaging.

集成电路圆片级测试探卡主要应用于分片封装前对芯片电学性能进行初测。

the methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free bga packaging.

着重研究了机械冲击和应力对无铅BGA封装焊点可靠性的影响，介绍了BGA封装的可靠性力学试验（跌落、弯曲试验）及其分析方法。

Under this standard, your test system must include a reference to packaging integrity and airproof detection.

根据此项标准, 你的包装测试系统必须包含对包装完整性和密封性的检测内容.

After test charger without packaging material, no electrical function failure and construction damaged are allowed.

在充电器未有包装的情况下, 进行落下试验,充电器电气功能不可损坏,结构不可破裂.

Packaging -- Box Pallets – General Requirements and Test Methods.

包装 —— 箱式卡板——一般要求和试验方法.