integrated circuits的例句大全

Si based heterostructure materials, as the second generation of Silicon, are more and more attractive, so Si based optoelectronic integrated circuits ( OEIC) as well as Si based optoelectronic devices become the key research projects over the world.

作为第二代硅，Si基异质结材料为世人所嘱目，Si基光电子器件及光电集成（OEIC）是当前世界范围的热门课题。

The Military Thick-film Hybrid Integrated Circuits Analysis of the Unqualified Reason and Control Methods of PIND Test Failure

军用厚膜混合集成电路PIND试验不合格原因分析及控制方法

The development trends of integrated circuits used in SPC telephone switching systems, system architecture, features and requirements of the switching systems are discussed.

本文对程控数字电话交换机所用的集成电路器件，交换机的系统结构以及性能要求的发展趋势进行了讨论。

The test failure control proposed is also applicable for the other fields of integrated circuits and discrete devices.

本论文提出的测试失效控制方法同样适用于其它集成电路及分立器件测试领域。

The integrated circuit contain thick film integrated circuit and the thin film integrated circuits.

集成电路有厚膜集成电路和薄膜集成电路。

The third-generation of computer is marked chiefly by the development of integrated circuits, which replaced transistors.

第三代计算机以集成电路取代晶体管为主要标志。

Third-generation computers: A computer that uses integrated circuits, disc storage and on-line terminals.

第三代电脑：采用组合线路，磁碟贮存和联机终端机的电脑。

Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits

厚膜集成电路网印应注意的技术问题

In this paper, a new and effective absorbing boundary condition, derived from Z-transform domain and FDTD method are used to analyze three dimensional microwave passive integrated circuits.

本文基于Z-变换域上导出的一种新的有效的吸收边界条件和FDTD法对三维微波无源集成结构进行了全波分析。

Timing Analysis of Digital Integrated Circuits

数字集成电路的时序分析

Based on the unit delay model, the analysis of glitch power in CMOS integrated circuits using timed Boolean function and timed reduced ordered binary decision diagram is presented.

在集成电路中器件延迟数学模型的基础上，介绍了如何利用定时布尔函数和定时有序二值决策图对集成电路Glitch Power进行分析；

Review of Fast Timing Simulation Techniques for Deep Submicron Integrated Circuits

深亚微米集成电路的快速时域仿真技术

Analysis of MIS Coplanar Stripline for Monolithic Microwave Integrated Circuits

单片微波集成电路中的MIS共面带线特性分析

The success of the transistor and advances in solid-state physics provided the foundation for another new technology, integrated circuits, IC's.

晶体管技术的成功和固态物理的进步为另一项新技术奠定了基础，那就是集成电路，也就是IC。

With the rapid development of integrated circuits, the traditional conductive pastes in which the sizes of the functional phase are in the range of micros can not meet the demands for low-temperature sintering, narrow line widths and multi-layer boards.

随着集成电路的高速发展，传统的微米级导电浆料已不能满足低温烧结和多层布线的要求。

With the development of deep sub-micron and nanometer CMOS process, it is possible to design and implement millimeter-wave CMOS integrated circuits with low cost.

随着深亚微米和纳米CMOS工艺的成熟，设计和实现低成本的毫米波CMOS集成电路已成为可能。

Ultrasonic welding of integrated circuits is of highest accurate. WS Wave Soldering

超声波焊接的集成电路，精密度极高。波峰焊接，THT元件的焊接方式

The very large scale monolithic integrated circuits have already reached the limit of integration or miniaturization. If we want to raise its packaging density and expand its function further, developing the three dimensional microwave integrated circuits ( 3DMIC) is the only way.

超大规模单片集成电路已经达到其集成或微型化的极限，要进一步提高其组装密度和扩展功能，唯一的途径就是发展三维微波集成电路（3DMIC）。

The field of electronics includes the electron tube, transistor, integrated circuits and so on.

电子学的范围包括电子管、晶体管和集成电路等。

National Conference on Design and Analysis of Medium and Large Scale Integrated Circuits

全国中、大规模集成电路设计及分析学术会议