polyimide的例句大全

A series of transparent polyimide/ silica ( PI/ SiO2) hybrid films were fabricated via sol-gel process using hydrolyzed tetraethoxysilane ( TEOS) under base condition.

采用碱催化正硅酸乙酯的溶胶/凝胶工艺制备了一系列透明聚酰亚胺/二氧化硅（PI/SiO2）纳米杂化薄膜。

Polyimide and polyimide/ SiO2 hybrid membranes were prepared via sol-gel process while Tetraethyl orthosilicate ( TEOS) was added as inorganic precursor.

以正硅酸乙酯为无机前驱体，采用溶胶-凝胶法制备了聚酰亚胺／SiO2无机杂化膜。

The dependence of refractive index on temperature and dispersion characteristic of the fluorinated polyimide film are gotten, and the measuring method and the measuring results are also reported.

实测了含氟聚酰亚胺薄膜的温度特性和色散特性，并给出了测量方法和测量结果。

Effect of High Temperature Treatment on Properties of Sol Film for Polyimide Precursor

高温热处理对聚酰亚胺前驱体凝胶膜性能的影响

Polyimide ( PI) film materials have been widely applied in many fields such as aviation, national defense, electronic device and optical-communication for their high tensile-strength^ high modulus and high dimensional stability.

高强、高模、高尺寸稳定性和加工性能优良的聚酰亚胺薄膜材料在航天航空、国防军工、电机电器、电子通讯等高新技术产业显示着广阔的应用前景。

Cyanate ester resin is a kind of high performance thermosetting resin and developed after the epoxy resin, bismaleimide and polyimide resin.

氰酸酯树脂是继环氧树脂、双马来酰亚胺树脂和聚酰亚胺树脂之后发展起来的一种高性能热固性树脂。

Laser irradiation caused in-situ reduction and agglomeration of silver on the polyimide film. The particle size of Ag particles ranged from 120 nm to 200 nm. Meanwhile, the Ag particles arranged parallel to the laser writing direction.

激光辐射还原生成的银纳米粒子的粒径在120&200nm之间，银粒子基本上沿着激光扫描的方向生长，呈规则排列，银纳米粒子与聚酰亚胺的粘附性良好。

The Thermal Aging Properties of Polyimide/ Al_2O_3 Hybrid Films

氧化铝掺杂聚酰亚胺薄膜的热老化研究

The co-condensation polyimide had good performance in dissolubility, mechanical properties, thermal behaviour etc, which compensated the shortage of the two correlative binary polyimides.

将此聚合物与两种二元共缩聚型聚酰亚胺的性能进行对此，发现三元共聚型聚酰亚胺的溶解性能、力学性能和热性能皆较好，且使用范围扩大。

The Thermal Decomposition Behaviour of PMR Polyimide Resin and Its Carbon Fiber Composite

KH－304热固性聚酰亚胺树脂及其碳纤维复合材料高温热稳定性的研究

A series of Al_2O_3 doped polyimide ( PI) composite films was successfully prepared via solution process, and the effect of the content of Al_2O_3 on the tensile strength, thermal property and breakdown strength of the composite films was studied.

通过溶液法，成功地制备了氧化铝掺杂聚酰亚胺纳米复合薄膜。探讨了Al2O3用量对聚酰亚胺纳米复合薄膜拉伸强度、热性能、电气强度的影响。

Polyimide ( PI) had been widely used in electric industries because of their outstanding characteristics, such as excellent tensile strength and modulus, low thermal expansivity and dielectric constant ε, good insulation capacity and good resistance to organic solvents.

聚酰亚胺因为其优异的性能被广泛的应用于电气工业，例如高强度与高模量，低热膨胀系数和介电常数，优异的绝缘性能和耐溶剂性。

According to substrate conditions of the thermal neutron converter, the aluminized polyimide film is selected as this substrate.

根据热中子转换体需要的衬底条件，选择了镀铝的聚酰亚胺薄膜作为衬底。

Thermosetting process and thermal degradation mechanism of high-performance polyimide

高性能聚酰亚胺树脂热固化过程及热分解机制的研究

Finally, we get the laminating process about polyimide materials and the excellent properties of polyimide to epoxy laminate such as heat resistance, thermal shock and glass transition temperature ( Tg) are discussed also.

最后，比较了聚酰亚胺层压板和环氧板在耐温性、热冲击、玻璃转化温度等方面的优异性能。

Thermal Transition Behavior for Thermoplastic Polyimide

热塑性聚酰亚胺热转变行为研究

Struture and morphology of hybride films are characterized by Fourier transform infrared apparatus and atomic force microscope. Thermal stability, transmittance of UV-Vis, mechanical properties and corona-resistance of polyimide hybrid films are tested.

采用红外光谱仪、原子力显微镜表征了杂化薄膜的结构和形貌，测试了杂化薄膜的热稳定性、紫外-可见光透过率、力学性能和耐电晕性。

Study of Thermally Stable Photosensitive Polyimide

耐热光敏聚酰亚胺胶的研究

Polyimide composites are an important class of thermally stable materials. Polyimide composites have been widely used in aerospace, microelectronics and other industrial fields because of its excellent properties, such as heat resistance, mechanical properties, electrical insulation and chemical resistance.

聚酰亚胺复合材料是一种的重要的耐高温材料，以其优异的耐热性、力学性能、电绝缘性以及耐药品性，在航空、航天、微电子等工业领域应用广泛。

Thermally Stimulated Current Study of Polyimide Film at High Pressures

高压力下聚酰亚胺薄膜热激电流的研究