pressure bonding的例句大全

In piezoresistive pressure sensor packaging process, the thermocompression wire bonding was studied to meet the outer interconnection of silicon gauge.

为满足压阻式压力传感器封装工艺中硅芯片外引线键合的要求，研制了热压焊简易装置；

Study on Thermosonic Flip Chip Bonding under Pressure Constraint Pattern

压力约束模式下热超声倒装键合的试验

A composite YAG/ Nd: YAG crystal was obtained by using the thermal bonding technique under a specific temperature and pressure.

本文在一定的温度和压力下，通过热键合技术，获得了YAG/Nd：YAG复合晶体。

This paper deals with the influences of the processing parameters ( canlender temperature, nip pressure, calender speed and pattern) on the properties of thermal bonding nonwoven fabrics.

本文分析探讨了热粘合加工工艺参数（轧辊温度、压力、速度和轧辊花纹）对热粘合非织造布性能的影响。

Using the hot embossing machine as the thermal bonding device, effects of the bonding temperature, pressure and time on the deformation of microchannel dimensions are systematically studied using the orthogonal factorial design.

使用热压机作为热键合设备，采用正交试验设计方法，系统地研究了键合温度、压强和时间对于热键合过程中微沟道变形的影响；

Films for lamination were prepared via a melt blending of thermoplastic polyurethane ( TPU) and polyester with low melt point, and their moisture permeability, thermal bonding properties, resistance to hydrostatic pressure and mechanical properties were tested.

用低熔点聚酯对热塑性聚氨酯进行改性，并对所制备的复合薄膜进行热粘合强度、DSC、透湿性、耐静水压以及力学等各项性能测试。

The bonding between chemical vapor deposition ( CVD) thick films diamond and cemented carbide was performed by diffusion brazing under controlled temperature, pressure and time. The filled intermediate layer materials are reactive metal Ti foil and Ag-Cu alloy foil.

采用扩散焊与钎焊相结合的方法，用Ti箔和Ag－Cu箔共同做中间层材料，在一定的温度、压力和保温时间下，实现了气相沉积金刚石厚膜与硬质合金间的牢固连接。

Measurement of Pressure Field of Bonding Region in Explosive Welding with Manganin Pressure Gauge

爆炸焊接结合区压力场的锰铜压力量计测量

The pressure field of bonding region in explosive welding has been measured with a manganin pressure gauge.

用锰铜压力量计测得了爆炸焊接结合区的压力场。

Of process parameters on the bonding strength of coating from the primary to the meeting were: spray distance, atomization air pressure, spray voltage, spray current.

工艺参数对涂层结合强度的影响由主到次依次为：喷涂距离、雾化空气压力、喷涂电压、喷涂电流。

Influence of contact pressure to bonding strength between fiber sheets and concrete

接触压对纤维布与混凝土粘结强度的影响

The influences of spinning speed, bonding area and roller pressure on the permeability performance of PET spun-bonded prefabricated vertical drain filters were tested and analyzed.

测试和分析了纺丝速度、轧点面积和轧辊压力对纺粘热轧滤膜透水率的影响。

In this paper we reported the process and principle of large-area GaAs epitaxial plate thermocompression bonded to K4 window-glass technology, and emphatically discussed the effects of the deposition of SiN film, the controlling of bonding temperature and the choice of pressure on bonding quality.

本文报道制备GaAs透射式光阴极过程中窗玻璃与大面积GaAs外延片热压粘结工艺的原理和过程，并重点分析抗反射膜的淀积、粘结温度控制和压力大小对粘结结果的影响。

bonding of subassemblies in blood pressure transducers, stopcocks, fittings, adapters and arterial filters

血压传感器，活塞，配件，配镜器和动脉过滤器等医疗器械的部件粘接；

industry: pressure processing; floor drain; mold equipment; machine parts processing; bonding process; electronic assembly process;

所属行业：压力加工；地漏；模具设备；机械零部件加工；邦定加工；电子组装加工；；

industry: offset; binding machine; molding; pressure processing; welding and bonding; advertising;

所属行业：胶印机；装订机；成型模；压力加工；焊接和粘接；广告策划；；

Other dissimilar materials bonding can benefit by pressure brazing.

压力钎焊也有助于其它异种材料的连接.

The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage.

晶圆键合机的基本原理是对需要键合的材料施加一系列的外部条件，比如压力、温度、环境、电压，不同的外部条件可以用来进行不同材料和结构的键合。

Design of welding pressure control system for ultrasonic gold wire bonding machine

超声波金丝球焊线机焊接压力控制系统设计