a c-band ingap/ gaas hbt power transistor with an optimized material structure and device peripheral structure is designed and fabricated by base-emitter metal self-aligning, emitter ballasting, and an electric plated air bridge.
通过优化InGaP/GaAs异质结双极晶体管(HBT)的材料结构和器件结构,采用BE金属自对准、发射极镇流和电镀空气桥等工艺技术,研制了C波段InGaP/GaAs HBT功率管。
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