semiconductor wafer的例句大全

Modeling technology for semiconductor wafer fabrication system based on Agent-oriented knowledge colored timed Petri net

基于多代理的知识有色赋时Petri网的晶圆制造系统建模方法

As the most complicated manufacturing system recognized world-wide, the semiconductor wafer fabrication system features a large number of tool groups, long production cycles and reentrance and does not fall into either of the traditional Flow-shop or Job-shop system.

半导体生产线是目前世界上公认的最复杂的制造系统，由于其自身的特点（设备数量众多，生产周期长，带重入循环等），与传统的Flow-Shop与Job-Shop模型存在很大的区别。

Methods of optimization for throughput and cycle time in semiconductor wafer fabrication

半导体晶圆制造中产量与生产周期的优化方法

Scheduling Rule for Batch Processing Machines of Semiconductor Wafer Fabrication Facilities

半导体生产线批加工设备调度规则

Decomposition Based Ant Colony Optimization Algorithm Applied to Semiconductor Wafer Fabrication System

基于问题分解的蚁群算法在半导体晶圆制造调度中的应用

The Semiconductor Wafer Fabrication System ( SWFS) is a very complex system with a variety of different kinds of equipment.

半导体晶圆制造系统的生产工艺复杂，设备价格昂贵、种类繁多。

analysis of the accuracy in the measurement for semiconductor wafer

半导体芯片电路线宽显微测量精度分析

research on swarm intelligence based scheduling model for semiconductor wafer fab

半导体生产线群体智能调度模型研究

application of spreadsheet in the capacity planning of semiconductor wafer fabrication

电子表格模型在半导体晶圆制造产能规划中的应用

Lot scheduling plays a very important role in semiconductor wafer Fab.

生产排程在半导体前段工厂中扮演相当重要的角色.

Drying process in IC production line, introducing spin rinsing? drying methods after semiconductor wafer cleaning. Also describing the technical principle, structure fea-tures and process applications for newly developed CXS series spin rinse?

从IC生产线晶圆片旋转冲洗甩干工艺出发，介绍了半导体晶圆片清洗后的旋转冲洗甩干方法，以及新近开发研制的CXS系列旋转冲洗甩干机的技术原理、结构特点及工艺应用情况。

lithography process is one of the most important semiconductor manufacturing process steps, it is used to copy mask plate pattern on the silicon wafer for next lithography step.

光刻工艺是半导体制造中最为重要的工艺步骤之一，其作用是将掩膜板上的图形复制到硅片上，为下一步工序做好准备。

yms-50 laser cutting machine special used in cutting for solar cell and semiconductor silicon wafer.

YMS-50激光切割机是专用于太阳能硅片电池切割的设备。

Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.

介绍了半导体行业的发展，晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。

Wafer handling robot is automated material handling equipment used in Lithography machine which is the core of semiconductor manufacturing equipment. Its working speed, positioning accuracy, reliability, cleanliness impact on the lithography process directly in the production efficiency and manufacturing quality.

光刻机是半导体制造的核心装备，硅片传输机器人是其内部专用的自动物料处理设备，它的工作速度、定位精度、可靠性，使用洁净度等直接影响光刻工序中的生产效率和制造质量。

evolution of wafer-surface preparation for semiconductor industry

半导体产业中晶圆片表面处理的发展

Wafer fabrication growth is the speediest one among china semiconductor in recent year.

在近几年的中国半导体发展中,晶园制造是发展最快的.

To smooth the surface of a wafer or semiconductor crystal.

使晶片或半导体晶体的表面光滑的过程.