tin plating的例句大全

Deposition mechanism of electroless plating tin in acid chloride solutions was analyzed theoretically, and three steps were summed up, including period of replacement reaction, coexistence periods of copper-tin codeposition and self-catalyzed deposition, and period of self-catalyzed deposition.

从理论上系统地分析了酸性氯化物化学镀锡的沉积机理，将其归纳为置换反应期、铜锡共沉积与自催化沉积共存期和自催化沉积期三个阶段。

Oxidation properties of tin coating by ion plating at high temperature

离子镀TiN涂层的高温氧化特性

Effects of Pulse Bias on TiN Coating in Arc Ion Plating

电弧离子镀技术中脉冲偏压对TiN薄膜的影响

A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.

采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。

Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation

锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠

TIN ( TITANIUM NITRIDE) Plating by physical Gas-Phase Sedimentation

物理气相沉积氮化钛涂层工艺