tin solder的例句大全

The determination of copper, iron, aluminum and zinc in tin solder by ICP-AES method is reported in this paper.

本文以ICP-AES法测定焊锡中铜、铁、铝、锌。

If only adjusting the size of flame to control the temperature of the hot airflow, it can solder whatever thick or thin plastic materials. Furthermore, tin head can be changed to carry out tin solder.

耐用，不易损坏，厚、薄塑料都能焊，只要调节火焰大小控制热气流温度就可以了，而且换上锡焊焊头还能进行锡焊。

The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.

重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。

Inspection for Leadless Tin Solder by AOI

自动光学检验设备（AOI）对无铅焊锡的检测

determination of stibium in tin solder by flame atomic absorption spectrometry

火焰原子吸收光谱法测定锡基焊料中锑

The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.

方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。

welding design of formwork can tsui on the molten solder flows tin solder formwork will not splash on stage in the job.

焊铁架之设计能把焊咀上的熔融锡流入焊铁架内，不会溅在工作台上。

The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.

该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。

When soldering ceramic radiating fins on electronic component such as powerful transistors for radio station, the silver film on the fins would be melted together with the tin solder and broken down.

电台用的电子部件如大功率晶体管等与陶瓷散热片焊接时，锡与银会共熔，银层从散热片上脱落。

The ICP-AES Method for Determination of Lead and Tin in Tin Solder

ICP&AES法测定焊锡中锡、铅含量

Joints between reinforcement members can be made satisfactorily with tin solder.

锡焊能够满意地做成加筋构件之间的接头.

The determination of lead and tin in tin solder by ICP-AES method is given in this paper.

本文利用ICP-AES法进行焊锡中Sn、Pb含量的测定。

Application of Computer Graphic Technology in Measurement of Tin Solder Spreading Area

电脑图形处理技术在锡焊料铺展面积测量中的应用

We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.

本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。

As a result, on tin-plated copper substrate, inorganic halide activator rosin flux ( No.5 flux) matching Sn-0.75 Cu solder can get the best wettability ( the wetting angle is 18 °), close to the wettability of Sn-37 Pb.

在镀锡铜片上，5焊剂匹配Sn-0.75Cu焊料能够获得最佳的润湿性（润湿角为18°），已接近Sn-37Pb焊料的润湿性。

Research Progress and Development Tendency of Tin-based Lead-free Electronic Solder

锡基无铅电子焊料的研究进展与发展趋势

solder tin of the thermo fuse with a defined low melting point,

有固定低熔点的温度保险丝中的锡焊料，

tin-antimony-silver-nickel solder for hermetical sealing

锡锑银镍封装焊料

nitrogen like in the tin-lead system will offer smoother solder joints and better wetting will be gained with the use of nitrogen.

与锡-铅系统类似，氮气可以使焊点更为光滑；使用氮气还可以得到更好的熔湿性。

estimates are that 60-70% of printed wiring boards are tin-lead solder coated, usually by hot air solder leveling (hasl).

据估计，60-70%的印刷线路板都带有锡-铅涂层，该涂层通常借助热空气焊料均涂（HASL）方法进行涂敷。