wafer method的例句大全

An automatic system for the measurement of two-dimensional distribution of resistivity of semi-insulating gallium arsenide wafer with three electrode guard method is presented in this paper. In actual application, the fluctuation of temperature and abnormal data obtained would influence the results of the measurement seriously.

本文介绍了三电极保护法半绝缘砷化镓材料电阻率二维分布自动测量系统，在实际应用中，温度波动、异常数据对测量结果产生严重影响，为此我们提出了一些措施。

The Area Contact Model of Depletion Layer Width Under Avalanche Breakdown in Si Epitaxial Wafer by a Three-Probe Method

三探针测试硅外延片中雪崩击穿时耗尽层宽度的面接触模型

The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method. Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding

在硅／玻璃激光键合中，温度场的分布是影响晶片能否键合的关键因素。用低温圆片键合实现传感器和微电子机械系统器件的集成和封装

The Finite Element Method ( FEM) has been widely applied to engineering structures design and mechanics analysis, so it would be signality to apply FEM to piezoelectric ceramics wafer and piezoelectric fiber composites analysis.

有限元法作为一种广泛应用于工程结构设计、力学分析的工具，将它应用于压电材料及压电纤维复合材料的性能分析中具有非常重要的意义。

Because the poly silicon heating method is completed at the wafer level, the quality of metal line can be monitored on-line with this method.

由于该方法是晶片级测试，而且测试时间非常短，所以采用这种方法可以实现对金属互连线质量的在线实时监控。

The wafer level packaging ( WL-CSP) technologies and their application progresses, which including the key technologies of WL-CSP, the package test description, the observation method and the reliability the analyses of WL-CSP are summarized.

综述了圆片级芯片尺寸封装（WL-CSP）的新技术及其应用概要，包括WL-CSP的关键工艺技术、封装与测试描述、观测方法和WL-CSP技术的可靠性及其相关分析等。

this work presents a novel method based on the plate wave sensor for in-situ monitoring of the thickness of a wafer during wet etching.

本文提出利用在不同基材上制作出板波感测器用来即时监控湿蚀刻中石英晶片及矽晶片厚度之新颖方法。

study on the new method of cd calibrating for ic wafer

IC晶片关键尺寸标定的新方法研究

new method of quality controlling of led epi-wafers

发光二极管外延片质量控制的新方法

A novel in-situ non-flatness measurement method wafer chuck in step-and-scan projection lithographic tool is presented.

提出一种新的步进扫描投影光刻机工件台方镜不平度测量方法.

A novel in-situ non-flatness measurement method of wafer chuck in step-and-scan projection lithographic tool is presented.

提出一种步进扫描投影 光刻机 承片台不平度检测新技术.

The method is to coat a wafer of silicon with a protective layer of silicon dioxide.

其方法是往硅片上涂上一层二氧化硅防护膜.

PVDF square wafer carriers for solar cell were developed by injection molding method.

论述了采用注射成型方式,对装载方形太阳能硅片的花篮进行研制的过程.