wafer process的例句大全

Through the reliability test, the NTC CUP process is suitable for thinner bond wire. So we can reduce the cost of the product which is lower driving current through wafer process change.

通过可靠性试验的研究发现，NTC的CUP工艺，在目前情况下只适用于线径较细的焊接工艺，因而可以对一些驱动电流较低的产品进行芯片工艺改进，降低芯片成本。

single-wafer process for improved metal contact hole cleaning

适合于改善金属接触孔清洗的单晶圆工艺

lithography process is one of the most important semiconductor manufacturing process steps, it is used to copy mask plate pattern on the silicon wafer for next lithography step.

光刻工艺是半导体制造中最为重要的工艺步骤之一，其作用是将掩膜板上的图形复制到硅片上，为下一步工序做好准备。

In wafer manufacturing process, the abnormal resistance of these two materials will directly affect products' wafer acceptance tests, leading to low yield.

在生产过程中，这两种互连材料的电阻异常会直接影响产品的电性能测试，导致低良率。

MEMC company, a worldwide leading silicon wafer manufacturer, has developed a rapid-thermal-processing ( RTP) based internal gettering ( IG) technology named after" magic denuded zone"( MDZ(?)), taking advantage of vacancy enhancement of oxygen precipitation.

MEMC公司根据空位对氧沉淀的促进作用采用快速热处理（RTP）技术开发出一种新型的内吸杂工艺&魔幻洁净区工艺（MDZ（？）

From the perspectives of size, operating cash flow, process technology level, new product development readiness for specific target market and availability of professional technical team, CRM is well equipped to invest in the 6 inch wafer fabrication plant.

从华润微电子目前的经营规模、资本结构、经营性现金流、工艺技术水平以及针对目标市场的产品开发准备和专业技术人才队伍来看，已经具备了建设6英寸芯片生产线的组织资源。

The intellectualized sensors accomplish temperature and static pressure compensation by software to solve a puzzle which non-smart sensors can't compensate static error ago, which has to resolve by improving process technology of wafer in previous technology.

传感器的智能化从数字运算上解决传感器的温度补偿、静压补偿问题，解决了以前静压无法补偿，仅靠工艺解决的难题；

Wafer handling robot is automated material handling equipment used in Lithography machine which is the core of semiconductor manufacturing equipment. Its working speed, positioning accuracy, reliability, cleanliness impact on the lithography process directly in the production efficiency and manufacturing quality.

光刻机是半导体制造的核心装备，硅片传输机器人是其内部专用的自动物料处理设备，它的工作速度、定位精度、可靠性，使用洁净度等直接影响光刻工序中的生产效率和制造质量。

intrinsic gettering technology used in the process of silicon wafer and silicon device

硅片和硅器件工艺中的本征吸除技术

automatic water baking machine: a wafer production equipment with electric power or lpg to generate the heat energy for automatic completion of mixture and baking process.

隧道式烤炉：是生产威化饼设备、下浆、烘烤、出饼片全自动完成，热能采用电或液化气。

extraction and utilization of process information from si wafer maps

硅片Map图信息的提取和利用

A two dimensional infrared antireflection relief pattern was fabricated on a Si wafer, using ion beam etching process.

利用离子束刻蚀工艺技术，在Si片上制备了一种两维红外抗反射浮雕图案。

in the process of chip manufacturing and packaging, wafer probe is very essential and the industry also has developed rapidly, mainly on the research of its device.

晶圆测试是芯片制造及封装过程中所必不可少的，该行业也得到了迅猛的发展，主要体现在相应设备的研究上。

WAT ( Wafer Acceptance Test ) is a very important stage of process.

WAT ( waferacceptancetest ) 是芯片制造过程中重要的测量站点.

Manufacturing Technicians perform functions associated with all wafer production including operations, equipments, process and training.

制造技术师进行相关的所有大晶片生产包括运营, 设备, 工艺和培训.

It is noted that there is a thin fluid film between the loaded asperities and the wafer being polished in CMP process, thereby a flow system with nano scale film is formed in.

在简述化学机械抛光技术的基础上，提出化学机械抛光过程中，受载的粗糙峰和被抛光的晶片表面之间存在一纳米量级的薄流体膜，形成了纳米级薄膜流动系统。

In summary, dry film photo-resist was applied to the wafer level high frequency flip-chip packaging process.

总结来说, 本文证实乾膜光阻适用于晶圆级高频 覆晶封装 制程.

With the theoretical analysis, the computer simulation and the process experiment methods, this paper studies the liquid forming mechanism of silicon wafer for ELCC technology and makes provision for further research on the solidification microstructure control of the silicon sheet.

采用理论分析、计算机模拟与工艺实验相结合的方法，对ELCC技术硅片液态成形机制进行了研究，为进一步对硅片凝固过程组织控制的研究奠定基础。

The goal to evaluating process is to find the defect of reliability, reliability parameters and datum can be acquired through wafer level and packaged level reliability experiments in specific test structures, according to failure mechanisms.

对工艺过程进行评估的目的在于找出存在可靠性缺陷的地方，它是针对技术磨损的机理，通过对专门设计的测试结构进行封装级或圆片级可靠性测试，获取可靠性模型参数和可靠性信息。

Drying process in IC production line, introducing spin rinsing? drying methods after semiconductor wafer cleaning. Also describing the technical principle, structure fea-tures and process applications for newly developed CXS series spin rinse?

从IC生产线晶圆片旋转冲洗甩干工艺出发，介绍了半导体晶圆片清洗后的旋转冲洗甩干方法，以及新近开发研制的CXS系列旋转冲洗甩干机的技术原理、结构特点及工艺应用情况。