plasma cleaning

The results from encapsulation peel tests, die and encapsulant pull tests, bonding wire pull tests and C-Mode SAM ( C-SAM) examination are presented. This paper demonstrates that the optimized plasma cleaning process would enhance PBGA package qualification level and improve the process yields and productivity.

陈述了密封剥离试验、芯片和密封剂拉力试验、焊线拉力试验和C-模式SAM（C-SAM）检查的结果，证明了最佳的等离子清洗工艺会增强PBGA封装的定性等级，并提高工艺效率和生产率。

In order to release the stresses originated from the lattice mismatch and reduce the defect densities, sapphire substrate surfaces are preprocessed by H-plasma cleaning, N-plasma nitriding and the low temperature buffer growth.

为了释放因晶格失配产生的应力，以降低在GaN外延膜中引起的缺陷密度，我们对蓝宝石衬底采用了氢等离子体清洗、氮等离子体氮化以及低温生长缓冲层的方法。

According to the relationship of thin film thickness and transmittance, we analysis the effect on thickness of thin film layers after plasma cleaning.

1利用膜层厚度与激光透过率的关系，分析等离子体清洗对sol-gel膜层厚度的影响。