清洗过程
Drying process in IC production line, introducing spin rinsing? drying methods after semiconductor wafer cleaning. Also describing the technical principle, structure fea-tures and process applications for newly developed CXS series spin rinse?
从IC生产线晶圆片旋转冲洗甩干工艺出发,介绍了半导体晶圆片清洗后的旋转冲洗甩干方法,以及新近开发研制的CXS系列旋转冲洗甩干机的技术原理、结构特点及工艺应用情况。
We also discuss the whole process from rinsing, bombarding to vibrating and rolling of material and explain the process of putting into effect on covering TiN-plate membrane of diamond.
同时通过对从清洗、轰击、到物料的振动与翻滚等全部工艺过程的论述,说明了金刚石覆镀TiN膜的实施过程。
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