single-crystal silicon

Thin films were prepared on K9 glass and polished single-crystal silicon by spin-coating method.

使用旋涂方法在K9玻璃和抛光的单晶硅基片上制备薄膜；

Single wafer silicon epitaxial CVD equipment has very good thickness a nd resistivity uniformity.

使用单片式外延炉生产的硅外延材料具有良好的厚度和电阻率均匀性.

The micro-information from micro-indentation in the surface of single crystalline silicon is analysed through transmission electron microscope at room temperature.

采用透射电镜（TEM）定位观察了室温单晶硅显微压痕表面的微观信息。

One of nine of the highest-paid executives in Silicon Valley last year lacked the one thing typically needed to attend their own company's annual shareholders meeting: a single share of company stock.

硅谷收入最高的企业高层中有九分之一去年都没有出席自己公司的年度股东大会，原因很简单，他们不买自己公司的股票。

Some common intrinsic semiconductors are single crystals of silicon, germanium, and gallium arsenide.

常用的本质半导体是硅 、 锗以及砷化镓等的单晶.

The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.

由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。

TiO _ 2 ARE Apply in Commercial Single Crystalline Silicon Solar Cell Production.

TiO_2减反射膜应用于商业化单晶硅太阳电池生产.

Acid-etching and alkali-etching methods were used to etch on single-crystalline silicon slice and the influence of temperature, time and solution concentration on the surface morphology was explored.

采用酸碱两种不同的化学蚀刻液对单晶硅表面进行蚀刻，通过扫描电镜（SEM）对其形貌进行了表征，考察了蚀刻液浓度、蚀刻时间及温度对表面形貌的影响。

Indention microcrack formation and propagation in single crystalline silicon at room temperature Interfacial Differential Capacity Analysis for Evaluation of the Monolayers on Crystalline Silicon Surface

室温下单晶硅压痕微裂纹的形成与扩展界面微分电容法单晶硅表面单分子膜质量的检测

Three sets of common silicon controlled single return circuit control system was replaced by an intelligent temperature control instrument which gives good solutions to temperature control hysteresis and disturbance between two sys-tems in the synthesis of O-cresol.

用一台智能控温仪代替三套常规可控硅单回路控制系统，解决了化工试验研究中大滞后系统的控温问题和系统之间的相互扰动问题。

The entire content of a book will be located on a single silicon chip.

整本书的内容只用一片硅芯片就可以装下.