temperature cycle test

Using this device can control the test point of contact line in shortcircuit and heat cycle experiment of catenary, as a result, the temperature of contact line can be measured.

使用该装置可以对接触网短路热循环实验各个测温点进行循环测量。

Through water pressure test, ammonia leakage test and field high temperature melted salt cycle test, it is shown that the tube joint welding quality meets completely the design and process demands.

经水压试验、氨渗漏检验及现场高温热熔盐循环试验，焊接接头质量完全达到设计及工艺要求。

The High-low temperature test box was used to apply thermal load to sample W-Al and Al-W, with a range of-40-120 ℃, a cycle of 120 minutes and total five loading cycles. And the temperature at the most values retained constant for 15 minutes. 4.

采用高低温综合试验箱对样品W-Al和Al-W施加热载荷，温度范围为-40-120℃，循环周期为120分钟，在最值温度处均保持恒温15分钟，共加载5个周期。

Thus, Ac 1f temperature equalization spheroidizing annealing technique is developed, which acquired good spheroidizing quality, shortened productive cycle and saved energy in production test.

由此开发出Ac1f透烧加热的球化退火工艺，生产试验取得了球化质量好、生产周期短及节能的效果。

Thermal cycle test demonstrates that the fatigue life of 3 D-MCM are more than 1500 temperature cycles.

热循环试验表明,3D-MCM具有大于1500个热循环周期的疲劳寿命,从而具有很高的热机械可靠性.

The technical feasibility of this design and the availability of the device were also verified in this paper by the multinode temperature collect and feedback control tests and the static life cycle test of this device.

通过引入多个节点的温度采集与反馈控制实验和节点生命周期静态测试实验验证了本设计的可行性和实用性。

This paper studied the influence of the different conductor material such as AU| Pd-Au, the different film thickness. 125 ℃. 300 ℃ thermal aging and temperature cycle on bond strength with two methods of destructive wire bond pull test and bond contact resistance test.

本文使用焊点破坏性拉力试验和焊点的接触电阻测试两种方法，研究了导体材料（Au、Pd&Au）、膜层厚度、125℃、300℃热老练和温度循环对焊点键合强度的影响。

Wet abrasion test under the conditon of freezing and thawing cycle shows that slurry seal can keep good durability in drastic temperature change.

冻融循环的湿轮磨耗试验表明了稀浆封层能在剧烈的温度条件的变化中保持良好的耐久性。

Carry on temperature cycle test on typical components, inspects solder joint crack in different cycle, observe microstructure of solder joint in virtue of metallographic analyse, study solder joint failure mode in temperature cycle and offer basis to improve technology parameter.

针对典型元器件进行温度循环试验，在不同的循环周期检查焊点的开裂情况，并采用金相分析观察焊点的显微组织，分析焊点在温度循环条件下的失效模式，为改进工艺参数提供依据。

Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.

焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。