thermosonic bonding

Thermosonic flip chip bonding is a reliable and efficient connection technique for power optoelectronic devices.

结果表明，在合适的热超声参数范围内，焊接后的功率型LED光电特性和出光一致性较好，证明了热超声倒装焊接技术是一种可靠有效的功率型光电子器件互连技术。

Time-Frequency Analysis of Capillary Tip Vibration in Thermosonic Bonding Process

引线键合劈刀超声振动信号的时频分析

Impedance analysis of PZT transducer by RMS method for thermosonic bonding

以有效值计算的热声键合PZT换能器阻抗分析

Dynamic Characteristics of Impedance and Power of PZT Transducer in Thermosonic Bonding Process

热超声键合PZT阻抗和功率动态特性研究

To improve the speed and accuracy of automatic frequency tracking on thermosonic wire bonding, the design scheme based on FPGA was proposed.

为进一步提高热超声引线键合超声电源的自动频率跟踪速度及精度，提出了基于现场可编程门阵列（FPGA）的超声电源设计方案。

These experiment phenomena and analyses can be used for bonding parameters match and optimization in thermosonic bonding.

这些试验现象和分析结果可作为整个键合系统工艺参数匹配及优化的依据。

The microelectronics packaging technology is developed to be thinner and smaller with the new technique of stacked chip package, while it also brings the challenge of low-loop for the thermosonic wire bonding process.

叠层封装技术满足了微电子封装向轻薄小发展的趋势，同时热超声键合技术的低弧大跨度带来了新的挑战。

In thermosonic chip bonding process, the impedance of PZT transducer is a very important parameter.

在热超声芯片键合过程中，PZT换能器阻抗是键合系统的一个重要的研究参数。

From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.

研究结果表明，在没有保护气氛的环境下，单晶铜丝可以热超声球键合和楔键合在金衬底和铝衬底上。

Formation of circle band interface of thermosonic flip chip bonding

热超声倒装键合环状界面的形成

In the present study, we investigated the effects of surface characteristics on the bondability of an Au-Au thermosonic bonding system.

在最近的研究中，我们调查了表面特性对金-金超声压焊系统的影响。

Research on Nonlinear Vibration of Contact Interface in Thermosonic Bonding Transducer System

热超声键合换能系统接触界面非线性振动研究

It can be concluded that the dynamic characteristics of impedance and power of PZT transducer can be as good parameters to analyze the thermosonic bonding system.

试验及分析表明，PZT换能器阻抗和功率变化反映了金球凸点与基板键合过程及键合质量的差别，可用以分析整个键合系统。

Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding

热超声倒装键合中温度对对准精度的影响

The system of the ultrasonic transducer is the key component of the bonding equipment in the thermosonic bonding system.

在热超声键合系统中，超声换能系统是键合装备的核心部分。

Study on Thermosonic Flip Chip Bonding under Pressure Constraint Pattern

压力约束模式下热超声倒装键合的试验

This investigation is to determine the effect of temperature on bonding strength, impedance and power of PZT transducer in thermosonic bonding process.

在有规律地改变键合温度的条件下，分析不同温度对热超声键合工艺连接强度的影响规律，并研究温度因素对整个系统的PZT换能器输入功率及阻抗的影响。

The stability and the delay time of the scan working model trigger system and the interrupt working model trigger system were compared and studied by the experiment of synchronization trigger of the thermosonic flip-chip bonding.

通过热超声倒装键合测量系统同步触发实验对比研究了单片机扫描工作模式和单片机中断工作模式触发系统的稳定性和触发延迟方面的性能。

Effect of different temperature on strength of thermosonic bonding

不同温度对热超声键合工艺连接强度的影响

Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding

热超声倒装键合过程中的非线性动力学行为

Multimode vibration analysis of transducer in thermosonic flip chip bonding

热超声键合换能系统振动多模态分析

The vibration simulation model of a transducer system in thermosonic wire bonding was established by finite element method and verified by electrical sine sweeping exciting experiment.

在建立热超声引线键合换能系统各子部分运动方程的基础上，利用有限元方法建立空载情况下换能系统的振动特性仿真模型，并采用正弦扫频方法验证仿真模型。

The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性.