three-electron bond

The bond strength of the samples was measured by three point bending test.

采用三点弯曲法测试金瓷结合力，扫描电镜观察钛瓷界面。

The order of single bond radii of the three structures during the elevation of temperature is fcc> bcc> hcp, and it is the same order for atomic volume.

温度上升过程中，3种结构的原子单键半径大小顺序为：fcc>bcc>hcp，导致相应的原子体积大小顺序为：fcc>bcc>hcp；

Objective: The aim of this study was to compare the micro-tensile bond strengths ( MTBS) of three adhesives to normal dentin ( ND) and caries-affected dentin ( CAD), evaluate The effect of thermocycling on MTBS.

目的：评价冷热循环对正常和龋坏内层牙本质粘接强度的影响。

A Study on the Batching Proportion of High Strength Three-element Bond for Vitrified Abrasive Tool Abrasive Machining

陶瓷磨具长石粘土硼玻璃三元系统高强度结合剂配料比实验设计研究

The results show that it is the smallest number of covalent electrons in d state of fcc-Au among that of the three structures that leads to the biggest single bond radii and atomic volume.

结果表明：OA理论得到的fcc-Au电子结构中的共价d电子数最少，从而导致fcc-Au具有最大的单键半径以及最大的原子体积；