tsv

TSV technology mostly used the ICP-RIE process, and using MEMS technics in future main packaging would speed up MEMS industry.

TSV技术主要采用ICP-RIE工艺，将MEMS技术应用于未来的主流封装技术将会进一步加快MEMS产业的速度。

The methods of3D interconnection can be classified into the wire bonding, flip chip, through silicon via ( TSV) and film wire technology, whose advantages and disadvantages are analyzed.

将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

TSV ( Through Silicon Via) is a new interconnected technology that used in high density 3-dimensional packaging.

硅通孔（Through Silicon Via，TSV）技术是一种应用于高密度三维封装中的新兴互连技术。

Considered factors of the cost, precision control and so on, dry process is generally used to fabricate TSV.

考虑到成本，精度控制等因素，一般倾向于使用干法刻蚀来制作TSV。

Electromagnetic transport measurements show that the thermal stability behavior for NiO being on the top of the spin valve ( TSV) is different from that for NiO being under the bottom of the spin valve ( BSV).

电磁输运测量表明，对相同Co/Cu/Co结构的自旋阀，NiO在自旋阀的顶部（TSV）和在自旋阀的底部（BSV）表现了不同的磁电阻值和热稳定特性。

Theoretically , canonical truncated singular value decomposition ( TSVD ) is considered a good regularization method in solving ill-posed problems.

典则 TSVD 方法是求解线性不适定问题的一种很好的正则化方法.

Among them, TSV is a very key process.

TSV的形成是其中很关键的一个工序。

Physical Map of RTSV, Glh in Oryza officinalis with BAC-FISH

RTSV和Glh在药用野生稻中的物理定位