封装

Resonant pressure sensors are fabricated by IC process and MEMS technology and bonded to a stress isolating mechanical structure and sealed into an evacuated package.

芯片利用半导体IC工艺和MEMS工艺制作，采用一种减小封装应力的结构，完成压力传感器的真空密封及封装。

Fixed error in file wrapper causing bad file copies.

修正在档案封装造成的坏档复制.

The voice data encapsulation policy is: for voice data entering Ethernet from PSTN and exchanging among Ethernet, MAC address is acted as addressing object when voice data is encapsulated;

语音数据的封装策略是：对于由PSTN进入以太网和在以太网内部交换的分组语音数据，封装时以MAC物理地址做为寻址对象；

Encapsulation has a similar effect on a collection of operations and properties.

封装起了类似的作用,把所需的操作和属性集合起来.

There are four translators in each package so a number of lines may be interfaced.

在每个封装壳中装有4个变换器,从而可以同许多线接口.

In electronic encapsulation fields, the traditional thermosetting resin is gradually substituted by thermoplastic materials because the later is a recyclable materials, thus more and more countries developed many thermoplastic include PPS for electronic encapsulation.

在电子封装材料方面，随着人民生活水品的逐渐提高，各国对环保的要求越来越高，因此用可回收的热塑性树脂对电子元器件进行封装是电子封装材料发展的重要方向。

What is encapsulation? Why it is useful?

什么是封装? 为什么封装是有用的?

The simulation results show that the temperature field of the ceramic packaged sensor is similar to that of unpackaged one, which proves the feasibility of this packaging scheme.

模拟结果显示，该封装后的传感器的温度场与未封装传感器相似，证明陶瓷封装结构是可行的；

With the development of electronic packaging technology, packaging pin number increasing, lead spacing smaller, encapsulated in the substrate of the area will be smaller.

随着电子封装技术的发展，封装引脚数越来越多，引线间距越来越小，封装体在基板上所占的面积也会更小。

A class encapsulates the properties and behaviors of an object.

类封装了对象的属性和行为.

Assembly of Advanced packages such as Ball Grid Array ( BGA ) and Chip Size Package ( CSP ).

先进封装的装配,如球形焊点阵列和芯片尺寸封装.

You will receive the letter in under a different cover.

你会收到那封装在不同信封里的信件.

It may be desirable to encapsulate larger sequences of commands.

存在着封装更大规模的命令序列的需求.

This sort of ultra-fine wires can be used as bonding wires.

该超细丝材可用作集成电路封装键合丝.

Talking about RFID Tag's Package Type and Packaging Process

千差万别异曲同工&谈RFID电子标签的封装形式和封装工艺

A novel gas sensor based on micro-machined ceramic hotplate and a wire-free bonding is presented, which is aim at the shortcomings of high power consumption and difficult to package existing in the current commercial ceramic gas sensors.

针对目前商用陶瓷气体传感器功耗大、封装难的缺点，提出一种陶瓷微加工微热板式气体传感器的结构和无内引线封装的方式。

But serial communications package better, also simple to use.

不过串口通讯类封装的较完善, 使用也简单.

Automatic Packaging pyramid time the four planes, each 160 W, high efficiency.

全自动封装层压机一次出四块, 每块160W, 效率高.

A delegate instance may encapsulate either static or instance method.

委托实例可以封装静态或实例方法.

Packaging is now receiving more attention by both packaged-device vendors and system builders.

现在封装越来越受到成品器件的销售人员以及系统的施工人员两方面的更多注意.

The self-alignment mechanism of flip chip bonding can improve the precision and repeatability of laser coupling.

而透过覆晶封装自动对准的优点,可以改善雷射封装位置的准确性.

The microcapsules are suspended in a substance similar to vegetable cooking oil.

微型封装块悬浮在像食用油那样的物质中.

The AC outlet is housed in robust aluminum housing.

该交流电插座封装在坚固的铝制外壳内.

Feb import dual-use monitoring system is linear and IC packaging.

电测系统选用进口双列封装的线性和集成电路.

In order to overcome the bottleneck of the 2-D package technology, a three-dimensional ( 3-D) package technology has been proposed.

为了克服平面封装技术的瓶颈，人们开发了一种三维封装技术，即叠层封装。

The optimized transformer of EPX ( EPO) has less several dB in THD than the transformer of EP when they have the same package size.

选择优化后的EPX（EPO）型磁芯制作的变压器比同等封装尺寸下EP型变压器的谐波失真要低几个dB，或在变压器谐波失真未有太大改变的情况下缩小了变压器的封装尺寸；

Comparison between Ultra-fine Pitch QFPs and BGAs and their Future

超细间距方形扁平封装与球栅阵列封装的比较及其发展趋势

Design of Memory Manage Encapsulation in Embedded Operating System Encapsulated Layer

嵌入式操作系统封装层中内存管理封装的设计

Two package methods of Fiber Bragg Grating ( FBG ) temperature sensors were introduced.

介绍了光纤光栅 ( FBG,FiberBraggGratings ) 温度传感器的两种封装形式.

A package with pins distributed over much or all of bottom surface of the package.

一种封装,插脚分布在封装底部的大部分或全部表面.