electronic packaging

Optimal design of plastic electronic packaging component based on BP neural network

基于BP神经网络的模塑封电子器件优化设计

Current Status of Research on Electronic Packaging Materials

电子封装材料的研究现状

Research on High Performance Novel Electronic Packaging Materials of Silicon-based Aluminum

新型硅基铝金属高性能电子封装复合材料研究

Power injection molding of mo/ cu alloy for electronic packaging

电子封装用注射成形Mo/Cu合金烧结工艺的研究

Research and Application of Copper Bonding Wire in Electronic Packaging

电子封装Cu键合丝的研究及应用

Fundamental study of new Si-Al electronic packaging materials

新型电子封装Si-Al合金的基础研究

Flip-chip bonding technology is a potential process in the electronic packaging.

凸点芯片倒装焊接是一种具有发展潜力的芯片互连工艺技术。

The Application of Several Electronic Packaging Technologies in Portable Electronics Products

几种电子封装技术在便携式电子产品中的应用

Therefore, it is very important to investigate the reliability of electronic packaging.

因此，对电子封装可靠性的分析非常重要。

Study on Manufacturing Aluminium Matrix Composites for Electronic Packaging Using Vacuum Pressure infiltration Casting

真空压渗铸造铝基电子封装复合材料研究

Recent achievements in research for electronic packaging substrate materials

电子封装基片材料研究进展

The Application of "5S" Activity in Electronic Packaging Industry

5S管理在电子封装企业中的应用

The present situation of lead-free system in electronic packaging

电子封装无铅化现状

Recent advances in the study of moisture absorption in plastic electronic packaging

吸收湿气对微电子塑料封装影响的研究进展

Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

等离子喷涂W-Cu电子封装材料的组织与性能

Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material

退火工艺对轧制复合CPC电子封装材料性能的影响

Study on the Thermal Failure of Metal Substrates in Electronic Packaging

电子封装技术中金属基板结构的热失效行为研究

Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

压制压力对Si-Al电子封装材料性能的影响

The development of materials and technology of electronic packaging

电子封装材料及其技术发展状况

The New Generation of Green Electronic Packaging Materials

新一代绿色电子封装材料

Application of the New Material in High-Density Electronic Packaging and its Prospect

浅析新材料在高密度电子封装上的应用及发展前景

The conversion to lead free is the trend in electronic packaging technology.

电子产品向无铅化转变是大势所趋。

Morphology of the water in plastic electronic packaging materials

电子封装塑封材料中水的形态

Theoretical Arithmetic and Optimum Design for the 0-3 Electronic Packaging Composites

0-3型复合电子封装材料的理论计算与优化设计

Chance and challenge of electronic packaging in China in 21 century

21世纪我国电子封装行业的发展机遇与挑战

Study on the Process of Cu/ Mo/ Cu Composite for Electronic Packaging

电子封装用Cu/Mo/Cu复合材料的工艺研究

Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

电子封装软钎焊焊点形态预测技术研究现状

A Study on Interface Failure Analysis and Reliability for High Temperature Electronic Packaging

高温电子封装界面失效分析及可靠性研究

New Progress of Electronic Packaging Technology

电子封装技术的新进展

The high reliability and low cost will lead thedevelopment of the electronic packaging.

集成电路封装的发展方向是高密度、低成本和高可靠性。