electronic packaging的例句大全

The present situation of lead-free system in electronic packaging

电子封装无铅化现状

With the development of electronic packaging technology, packaging pin number increasing, lead spacing smaller, encapsulated in the substrate of the area will be smaller.

随着电子封装技术的发展，封装引脚数越来越多，引线间距越来越小，封装体在基板上所占的面积也会更小。

Metal Matrix composites ( MMC) have received substantial attention as Electronic Packaging Material, because of theirs properties: high thermal conductivity and low coefficient of thermal expansion.

金属基复合材料作为电子封装材料，具有高导热、低膨胀的特点。

Theoretical Arithmetic and Optimum Design for the 0-3 Electronic Packaging Composites

0-3型复合电子封装材料的理论计算与优化设计

A Study on Interface Failure Analysis and Reliability for High Temperature Electronic Packaging

高温电子封装界面失效分析及可靠性研究

The development of materials and technology of electronic packaging

电子封装材料及其技术发展状况

Optimal design of plastic electronic packaging component based on BP neural network

基于BP神经网络的模塑封电子器件优化设计

Research on High Performance Novel Electronic Packaging Materials of Silicon-based Aluminum

新型硅基铝金属高性能电子封装复合材料研究

Chance and challenge of electronic packaging in China in 21 century

21世纪我国电子封装行业的发展机遇与挑战

Study on the Thermal Failure of Metal Substrates in Electronic Packaging

电子封装技术中金属基板结构的热失效行为研究

Current Status of Research on Electronic Packaging Materials

电子封装材料的研究现状

The Application of Several Electronic Packaging Technologies in Portable Electronics Products

几种电子封装技术在便携式电子产品中的应用

Application of the New Material in High-Density Electronic Packaging and its Prospect

浅析新材料在高密度电子封装上的应用及发展前景

Research and Application of Copper Bonding Wire in Electronic Packaging

电子封装Cu键合丝的研究及应用

The conversion to lead free is the trend in electronic packaging technology.

电子产品向无铅化转变是大势所趋。

Recent advances in the study of moisture absorption in plastic electronic packaging

吸收湿气对微电子塑料封装影响的研究进展

The New Generation of Green Electronic Packaging Materials

新一代绿色电子封装材料

Therefore, it is very important to investigate the reliability of electronic packaging.

因此，对电子封装可靠性的分析非常重要。

Recent achievements in research for electronic packaging substrate materials

电子封装基片材料研究进展

New Progress of Electronic Packaging Technology

电子封装技术的新进展