transistor package的例句大全

Quantitative evaluation of defect according to infrared nondestructive testing principle and quality testing of solder layer of F-4 power transistor package are described. Computer processing results of infrared thermal images are also given.

根据红外无损检测原理，提出了缺陷的定量检测方法，并探讨了F-4型半导体功率管管壳焊料烧结质量的检测方法，最后给出了热图象的计算机处理结果。

Cleaning Technique of Plastic Package Transistor Before Ink Signet Printing

塑封晶体管油墨印章打印前的清洗处理工艺

the fully automatic transistor die bonder is a modern semiconductor package equipment that utilizes interdisciplinary technologies such as fine mechanics, auto control, image recognition, optics and so on.

全自动晶体管粘片机是集精密机械、自动控制、图像识别、光学等领域于一体的半导体封装关键设备，主要用于半导体制造后端工序中将晶圆上微芯片粘接到引线框架上。