CMP的例句大全

in the latter case, you needed to implement the pushdown process in the cmp method.

后来，需要在CMP方法中实现叠加过程。

after saving this cmp bean, the pushdown entities panel will look like figure 8.

保存该CMPbean后，叠加实体面板将类似于图8。

repeat steps 2 through 5 to mark those methods in the transactionhistory cmp bean that use stored procedures as pushdown methods.

重复步骤2到步骤5，给TransactionHistoryCMPbean中的那些将存储过程作为叠加方法的方法做上标记。

chemical-mechanical polish (cmp) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing.

化学-机械抛光（CMP）-平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。

dependency of material removal rate on velocity in cmp of microelectronic materials

微电子材料CMP加工中去除率与速度的关系

tightly-coupled multiprocessing refers to chip-level multiprocessing (cmp).

紧密耦合多处理指芯片级多处理（CMP）。

experimental study on influences of dispersant on material removal rate and the surface roughness of cu cmp

分散剂对铜CMP材料去除率和表面粗糙度影响的实验研究

chemical-mechanical polish ( cmp)-a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing.

化学-机械抛光（CMP）-平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。

Experiment of Cystine Mother-Liquid Powder ( CMP) in Broiler Raising

胱氨酸母液粉对肉鸡的饲养试验

when the plug and ild are formed simultaneously, it is termed a dual damascene cmp.

当插件和ILD形成同时，它被称为双重镶嵌中医。

figure 11 shows a case when we have selected a 2. 0 cmp bean, dragged the out-going connector handler, and dropped it on the digram surface.

图11显示的实例中，用户选择了2.0CMPbean，拖动外向连接器句柄，并将其下移到图表上。

study on cmp effluent and its treatment by an integrated process

混合材CMP废液综合治理技术的研究

applying cmp technology improves agility and efficiency of enterprise management information system.

应用CMP技术提高了企业信息化系统应用的敏捷性和高效性。

refraction seismic interpretation method in cmp domain and its application case

共中心点域浅层折射波解释方法及应用实例

research on cmp load balancing scheduling algorithm based on hypercube structure

基于超立方体结构的CMP均衡调度算法研究

study on kinematic mechanism of rotary cmp equipment with single head

单头单面旋转式化学机械抛光机的运动机理研究

properties of surface oxidation film in cmp of computer hard disk substrate

计算机硬盘基片CMP中表面膜特性的分析研究

estimation of quality factor from cmp gathers and its application

共中心道集中品质因子的估计及应用

based on the research results, the material removal mechanisms of copper cmp were analyzed.

根据现有的研究成果主要介绍了铜化学机械抛光的化学材料去除机理；

analysis of influencing factors of sapphire substrate cmp removal rate

蓝宝石衬底材料CMP去除速率的影响因素