lithography的例句大全

The design of a new kind of UV or DUV lithography lenses is described in this paper.

设计了一种新的紫外或深紫外光刻物镜。

Measurement system of precision stage shows its important role for the correction technology E-Beam lithography machine.

由于电子束曝光机采用的修正技术,工件台的测量系统显得十分重要.

ers 10 nano-imprint lithography system test of commercial enterprises.

ERS10压印系统的商用测试企业.

the principle on stereo lithography, laser source , photo curing resin and photo-initiator were reviewed.

简要介绍了快速制造技术,阐述了光固化成型原理,激光光源及所用光固化树脂.

This phenomenon is due directly to the flourishing of workshop printing, the development of movable type printing and lithography.

这与明中叶以来书坊的遍布、活字印刷的发展及石印的推广直接相关。

The MSM PD is fabricated using standard optical lithography and lift-off process.

器件采用标准的光刻和剥离技术制作。

lithography process is one of the most important semiconductor manufacturing process steps, it is used to copy mask plate pattern on the silicon wafer for next lithography step.

光刻工艺是半导体制造中最为重要的工艺步骤之一，其作用是将掩膜板上的图形复制到硅片上，为下一步工序做好准备。

principle of electron beam lithography and its application on the nanofabrication and nanodevice

电子束光刻技术的原理及其在微纳加工与纳米器件制备中的应用

offset lithography: a modification of the lithography process by an american i. w. rubul.

间接石印（柯式）：由美国人鲁布把石印方法改良而成的间接印刷方法。

the principles of liga process on mask, x-ray lithography, electroform and model were analyzed.

对LIGA工艺掩膜、X射线光刻、电铸及塑铸等进行了工艺原理分析。

Lithography and Reactive Ion Etching of Silicon-Based Photon Crystal Slab

硅基光子晶体板的光刻和反应离子刻蚀

The development of soft X-ray CZP included design of optical path, selection of material, preparation of thin film, sub-micron lithography, X-ray lithography, reactive ion etching, ion beam etching, electroplating and chemical etching.

软X射线聚焦波带片的研制包括光路设计、膜系设计、衬底选择、薄膜制备、亚微米光刻、X射线光刻、反应离子刻蚀、离子束刻蚀、电镀和化学腐蚀等多种微细加工技术。

The novel methods include nano-imprint, laser interference lithography, x-ray lithography, electron beam lithography, focused ion beam and so on.

包括纳米压印、激光干涉光刻、x射线光刻、电子束光刻、聚焦离子束刻蚀等。

progress of scanning probe lithography and study on scanning plasma etching technology

扫描探针加工技术的新进展及扫描等离子体加工技术的研究

Simulation of X-ray Lithography Mask Distortion during Back-etching

X射线光刻掩模背面刻蚀过程中的形变仿真

power semiconductor device chip manufacturing process is actually repeated several times on film formation, lithography and doping process in a substrate, and its primary task is to solve the problem of film formation.

功率半导体器件芯片制造过程中实际上就是在衬底上多次反复进行的薄膜形成、光刻与掺杂等加工过程，其首要的任务是解决薄膜制备问题。

in the next generation lithography ( ngl) technology, extremely ultraviolet lithography ( euvl) has high-resolution, certain output and technical extension property of traditional lithography, so it becomes one of the first-selected lithography schemes for preparing the nanometer ulsi de-vices in ic circles.

在下一代光刻技术中，由于极紫外光刻（EUVL）分辨率高、且具有一定的产量优势及传统光学光刻技术的延伸性，因而是IC业界制备纳米级ULSI器件的首选光刻方案之一。

research on nanostructures fabricated by atom lithography with~ ( 52) cr

~（52）Cr原子光刻制作纳米结构研究

It is well known that optical limitation is the bottle neck in traditional lithography process.

由于传统的光刻生产工艺有透镜光学极限性,压印光刻为集成电路的生产提供了一种新思路.

This article mainly explains the process of LIGA technology, which includes X-ray lithography,-electroforming and-copy.

本文主要阐述了LIGA技术 的工艺过程, 包括 X 射线深层光刻 、 微电铸和微复制工艺.