solder joint的例句大全

Thermal fatigue life analysis on the PBGA Solder Joint

PBGA焊点的热疲劳寿命分析

So, it is very crucial to study the effect of SOH on the microstructure and reliability of solder joint.

所以，研究互连高度对焊点微观组织和可靠性影响是很有必要的。

With the reduction of SOH, the thickness of IMC decreases, while the proportion of IMC layer to solder joint increases.

随着互连高度的降低，两侧IMC的平均厚度降低，IMC所占焊点的比例增加。

Thermal fatigue Random variable Probabilistic analysis Solder joint Lognormal distribution;

热疲劳；随机变量；概率分析；焊点；对数正态分布；

The results show that the volume of solder, interstice height, and size of bonding pad have a remarkable effect on the 3-D shapes of LCCC solder joint.

结果表明，钎料体积、间隙高度、焊盘尺寸对LCCC焊点三维形态有显著的影响。

Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability

陶瓷阵列封装的两种形式及其接头可靠性

Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology

细微间距器件焊点形态成形建模与预测

Whatever shapes of solder joints, under the thermal loading, the distribution of the largest equivalent Von Mises stress/ strain are all approximately same which is in the brim of solder close to the joint of solder and PCB.

研究发现，在热载荷作用下，鼓形、凹形及柱形钎料焊点的最大应力应变分布大致相同，均在钎料球的外边缘。

Shape prediction and reliability analysis of QFP solder joint

QFP焊点形态预测及可靠性分析

Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL.

主要研究了不同氧含量对QFP引脚焊点拉伸强度的影响，得到一个最佳的氧含量范围。

Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint.

皂化剂中所含成分, 若不采用适当的抑制剂, 将会侵蚀金属表面, 造成焊点钝化.

The quality of solder joint affects the reliability of the products produced by SMT directly.

由表面组装技术(SMT) 形成的产品,其焊点质量直接影响到产品的可靠性.

Solder end valves are limited by temperatures which affect the strength of the solder joint.

焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内.

Transition fittings are available for adapting to new or existing threaded or solder joint ends.

还可提供转换管件,用于适配新的或现存的螺纹或焊料连接端口.

Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.

焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。

REWORK solder joint performed well in the environmental reliable tests, with the cycles of thermal shock cycles increasing its reliability has been to maintain a high level.

REWORK焊点在环境可靠性测试中表现良好，随热冲击循环次数的增加其可靠性一直维持着较高水平。

When dell time and temperature range dwell was fixed, the fatigue life of critical solder joint was the function of ramp rate.

在保温时间和温度范围不变的情况下，关键焊球的疲劳失效寿命是升降温速率的函数。

In this paper, the solder joints are divided into two groups according to analysis with unit temperature load. Non-critical solder joint was condensed by performing static substructure method.

在本文中，首先根据单位温度加载的分析结果将焊球分为关键焊球与非关键焊球两组，对非关键焊球使用静态子结构法进行静凝聚，然后再进行温度循环分析。

modeling and predicting solder joint shapes of ball grid array

球栅阵列（BGA）器件焊点形态成形建模与预测

ball valves threaded, socket-welding, solder joint, grooved and flared ends.

球阀螺纹，承插焊接，焊接连接，带槽和扩口连接。