solder joint

Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.

焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。

Transition fittings are available for adapting to new or existing threaded or solder joint ends.

还可提供转换管件,用于适配新的或现存的螺纹或焊料连接端口.

The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package ( 2 656 circulations).

SCSP的焊点热疲劳寿命模拟值为1052个循环周，低于单芯片封装元件的焊点热疲劳寿命（2656个循环周）。

Thermal fatigue life analysis on the PBGA Solder Joint

PBGA焊点的热疲劳寿命分析

The quality of solder joint affects the reliability of the products produced by SMT directly.

由表面组装技术(SMT) 形成的产品,其焊点质量直接影响到产品的可靠性.

Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL.

主要研究了不同氧含量对QFP引脚焊点拉伸强度的影响，得到一个最佳的氧含量范围。

Impacts of Void Defects on Thermal Fatigue Life in Coaxial-cable Solder Joint

气孔缺陷对同轴电缆焊点热疲劳寿命影响

REWORK solder joint performed well in the environmental reliable tests, with the cycles of thermal shock cycles increasing its reliability has been to maintain a high level.

REWORK焊点在环境可靠性测试中表现良好，随热冲击循环次数的增加其可靠性一直维持着较高水平。

The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.

该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。

Resistance strain and temperature hysteresis loops properties of lead free solder joint

无铅焊点的电阻应变温度迟滞回线特性

Important procedures for preparing a solder joint are graphically illustrated in this catalog on page 48.

焊料连接准备工作的重要步骤在本样本第48页中有图文并茂的描述.

The Statistical Analysis and Optimal Evaluating on Thermal Fatigue Life of CCGA Based on Solder Joint Shapes

CCGA焊点热疲劳寿命统计分析与评价优化

Solder end valves are limited by temperatures which affect the strength of the solder joint.

焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内.

The mismatch of thermal expansion results in an integral warpage of assemblies in the case with underfill, which decreases the shear deformation of solder joint and increases the interface stress on the chip.

填充芯下填料后的倒扣芯片连接由于胶的机械耦合作用，降低了焊点的剪切变形，但热失配引起的器件整体弯曲增强，芯片的界面应力增大。

Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

电子封装软钎焊焊点形态预测技术研究现状

When dell time and temperature range dwell was fixed, the fatigue life of critical solder joint was the function of ramp rate.

在保温时间和温度范围不变的情况下，关键焊球的疲劳失效寿命是升降温速率的函数。

Thermal stress analysis and fatigue life prediction for solder joint of SCSP

叠层芯片封装元件热应力分析及焊点寿命预测

Shape prediction and reliability analysis of QFP solder joint

QFP焊点形态预测及可靠性分析

Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint.

皂化剂中所含成分, 若不采用适当的抑制剂, 将会侵蚀金属表面, 造成焊点钝化.

Effects of Stand-off Height between Chip Component and Substrate on Lead-free Solder Joint Reliability

片式元件与基板间隙对无铅焊点可靠性的影响

Solder joint reliability is highly dependent on solder ball height uniformity/ coplanarity, so it is very important to measure the height of solder balls on chips.

BGA焊点的可靠性与芯片上焊球高度的一致性（共面度）息息相关，因此需要测量芯片上焊球的高度值。

The major failure form of solder joints is thermal fatigue and fracture damage, and the deformation behavior and response of stress is very complex due to the complicated service conditions of solder joint.

钎焊点失效的主要形式为热-机械疲劳与断裂破坏，由于焊点服役条件的复杂性，其变形行为和应力响应也十分复杂。

In this paper, the solder joints are divided into two groups according to analysis with unit temperature load. Non-critical solder joint was condensed by performing static substructure method.

在本文中，首先根据单位温度加载的分析结果将焊球分为关键焊球与非关键焊球两组，对非关键焊球使用静态子结构法进行静凝聚，然后再进行温度循环分析。

Theoretical models are given to qualitatively explain the relationship between the solder joint volume and performance.

理论模型也定量给出了焊膏厚度与焊点性能之间的关系.

The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life

PBGA焊点热疲劳寿命的正交试验及回归分析

Nitrogen protection can improves wettability of lead-free solder and solder joint quality.

氮气保护可以改善无铅钎料的润湿性,提高焊点质量.

Interface void damage is the failure characteristic of solder joint under temperature cycling.

温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度.

Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology

细微间距器件焊点形态成形建模与预测

Effects of thermal cycle parameters and substrate dimensions on solder joint reliability

热循环参数及基板尺寸对焊点可靠性的影响

Carry on temperature cycle test on typical components, inspects solder joint crack in different cycle, observe microstructure of solder joint in virtue of metallographic analyse, study solder joint failure mode in temperature cycle and offer basis to improve technology parameter.

针对典型元器件进行温度循环试验，在不同的循环周期检查焊点的开裂情况，并采用金相分析观察焊点的显微组织，分析焊点在温度循环条件下的失效模式，为改进工艺参数提供依据。