wire bond的例句大全

Better manufacturing yield than wire bond for high pin-count chips.

对于高密度引脚芯片,成品率优于丝键合.

Faster manufacturing through-put than wire bond for high pin-count chips.

对于高密度引脚芯片,生产效率高于丝键合.

After thermal aging, some effects on wire bond reliability are observed.

500小时的热老化对焊点的可靠性有一定的影响。

fully automatic gold wire bonder is the key device of the package equipment for micro-electrons, which is associated with integrating technologies of fine mechanics, automatic control, image recognition, computer application, optics and ultrasonic wave bond.

全自动金丝球焊机是微电子封装设备中的核心设备，它是集精密机械、自动控制、图像识别、计算机应用、光学、超声波焊接等多领域技术于一体的现代高技术微电子生产设备。

Check the Quality of Package Strictly to Improve the Wire Bond Reliability of SAW Device

加强管壳检验工作，提高SAW器件的键合可靠性

The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface charac-teristics.

引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。

Improving Al clad Steel Wire Bond By Regulating Tool and Die of CONFORM Clad Machine

CONFORM包覆机工模具调整提高铝包钢丝结合力

This paper studied the influence of the different conductor material such as AU| Pd-Au, the different film thickness. 125 ℃. 300 ℃ thermal aging and temperature cycle on bond strength with two methods of destructive wire bond pull test and bond contact resistance test.

本文使用焊点破坏性拉力试验和焊点的接触电阻测试两种方法，研究了导体材料（Au、Pd&Au）、膜层厚度、125℃、300℃热老练和温度循环对焊点键合强度的影响。

As SAW filters becoming smaller and lighter, the general wire bond has imposed restrictions on its development.

随着SAW器件向小型化、轻型化的发展，传统的引线键合技术已对其形成严重制约。

In addition, some specimens are annealed at a high temperature for 500 hrs in order to investigate the effect of thermal aging on wire bond reliability.

另外，为了研究热老化对焊点可靠性的影响，一些样品被放置在恒温炉中储存500小时。

When the aging time is 40 d, the cloud-like structure transforms into rectangular island-like structure and there are many cavities inside the bond wire, which are different from the Kirkendall voids because of the shape and dimension.

老化40d时，引线内部出现大量的孔洞并存在方块岛状的Al-Ni组织，其尺寸和形状显示与Kirkendall孔洞不同。

Through the reliability test, the NTC CUP process is suitable for thinner bond wire. So we can reduce the cost of the product which is lower driving current through wafer process change.

通过可靠性试验的研究发现，NTC的CUP工艺，在目前情况下只适用于线径较细的焊接工艺，因而可以对一些驱动电流较低的产品进行芯片工艺改进，降低芯片成本。

bond strength and splice length of welded wire mesh in reinforced concrete slabs

焊接钢筋网在混凝土板中的粘结和搭接长度

Sensing the pressure and as a result of tightening bonds spreads some high-yield bond funds in Hong Kong have hard-wired in a provision to maintain dividends by paying investors out of capital rather than from the income received from the underlying bonds.

感受到这种压力，再加上债券息差日益缩小，香港部分高收益债券基金加入一个条款，拟用资本（而不是从标的债券获得的收入）向投资者支付股息。

a study on the interfacial bond strength and transversal wire effect of ferrocement

钢丝网水泥界面粘结强度与横丝效应的研究

Our main products include prestressed concrete strand, steel wire, strand, etc. without bond.

公司主导产品有预应力混凝土用钢绞线 、 钢丝, 无粘结钢绞线等.

Bond and Life Bond strength and splice zone of welded wire fabric in reinforced concrete slabs

焊接钢筋网在混凝土板中的粘结和搭接长度

In the case of the large bond trader, the bridge has narrowed to the size of a thin wire.

对这个大量交易债券的交易者来说，桥面已经窄到了一根铁丝的程度。

The wire mesh and center tube are epoxy-bonded to the end caps.

该丝网和中心管是环氧树脂粘结到去年底的上限.

The bond wire, the via hole and the uncontinuity of the microstrip's effect have been taken into account.

分析了变容二极管的等效电路模型，考虑了微带的不连续性、键合引线、通道孔对电路的影响。