wire bond

Faster manufacturing through-put than wire bond for high pin-count chips.

对于高密度引脚芯片,生产效率高于丝键合.

The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface charac-teristics.

引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。

Check the Quality of Package Strictly to Improve the Wire Bond Reliability of SAW Device

加强管壳检验工作，提高SAW器件的键合可靠性

After thermal aging, some effects on wire bond reliability are observed.

500小时的热老化对焊点的可靠性有一定的影响。

Better manufacturing yield than wire bond for high pin-count chips.

对于高密度引脚芯片,成品率优于丝键合.

Bond and Life Bond strength and splice zone of welded wire fabric in reinforced concrete slabs

焊接钢筋网在混凝土板中的粘结和搭接长度

As SAW filters becoming smaller and lighter, the general wire bond has imposed restrictions on its development.

随着SAW器件向小型化、轻型化的发展，传统的引线键合技术已对其形成严重制约。