wire bonding的例句大全

finally, wire bonding technics in the retral packaging of schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

with the development of the integrated circuit industry, the welding speed and welding line quality of the wire bonding machine appear new demands and challenges.

随着集成电路行业的发展，对引线键合机的焊线速度和质量提出了新的要求和挑战。

twisted-pair were in the wire bonding method sometimes used for coaxial cable, the method can make it smaller, lighter, cheaper.

在双绞线中黏合导线的方法有时也用于同轴电缆，这种方法能使其更小、更轻、更便宜。

metal wire bonding interconnection is the key means in the internal matching technology of rf power transistor.

金属键合线互连是射频大功率晶体管内匹配技术中的关键手段。

The thermocompression wire bonding strength was tested with bonding tester. The strength was over 0.17 N.

使用接合强度测试仪对压焊键合点强度进行了拉断试验，测得键合强度拉断力都在0.17N之上。

The microelectronics packaging technology is developed to be thinner and smaller with the new technique of stacked chip package, while it also brings the challenge of low-loop for the thermosonic wire bonding process.

叠层封装技术满足了微电子封装向轻薄小发展的趋势，同时热超声键合技术的低弧大跨度带来了新的挑战。

The methods of3D interconnection can be classified into the wire bonding, flip chip, through silicon via ( TSV) and film wire technology, whose advantages and disadvantages are analyzed.

将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

The thermoageing failure mechanism after aluminium wire bonding of this gold conductor and function of added alloy are discussed.

在金浆中添加了少量合金元素，并选用混合型粘结剂。

Through the track of anti-oxidation, make rail temperature 40 ° c and no oxidation, improve the wire bonding ability.

通过轨道的防氧化改造，使轨道温度升高40℃也没有发生氧化，提高了铜丝键合能力。

To improve the speed and accuracy of automatic frequency tracking on thermosonic wire bonding, the design scheme based on FPGA was proposed.

为进一步提高热超声引线键合超声电源的自动频率跟踪速度及精度，提出了基于现场可编程门阵列（FPGA）的超声电源设计方案。

The vibration simulation model of a transducer system in thermosonic wire bonding was established by finite element method and verified by electrical sine sweeping exciting experiment.

在建立热超声引线键合换能系统各子部分运动方程的基础上，利用有限元方法建立空载情况下换能系统的振动特性仿真模型，并采用正弦扫频方法验证仿真模型。

The parameters of FAB ( free air ball) process during copper wire bonding were optimized.

对铜丝球键合焊形球过程FAB参数进行了优化。

Considering these factors, the flowing two parts should be considered in the wire bonding process: Free air ball formation and Looping stability.

对应于这些参数在焊线机制程的关键技术，可分为金线结球及焊线路径稳定性两个部分。

Ultra-fine-pitch wire bonding may make some parameters to their physics extreme, require the free air ball and bonded ball of smaller diameter and the diameter of gold line adopted.

超细间距引线键合将部分参数推向其物理极限值，要求更小直径的金球（Free Air Ball）和键合球（bonded ball），所采用的金线直径更小。

In piezoresistive pressure sensor packaging process, the thermocompression wire bonding was studied to meet the outer interconnection of silicon gauge.

为满足压阻式压力传感器封装工艺中硅芯片外引线键合的要求，研制了热压焊简易装置；

Transient Temperature Property of Ultrasonic Wire Bonding Process

超声引线键合过程的瞬态温度特性

Analysis of Copper Wire Bonding Capability in Chip Packaging

芯片封装中铜线焊接性能分析

A Novel Instrument of Thermocompression Wire Bonding

一种硅芯片外引线键合的热压焊简易装置

Effect of ultrasonic power on the wire bonding strength

超声功率对引线键合强度的影响

As the demand increasing steadily for small volume 、 high density and high heat-dissipation rate IC, the key parameter of wire bonding& pad pitch has to shrink in accordance.

由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数&焊盘间距也不断缩小以满足市场要求。