wire bonding的例句大全

Set up an ultrasonic wire bonding laboratory.

成立超声波电子焊接实验室.

Set up ultrasonic wire bonding laboratory.

成立超声波电子焊接实验室。

The automatic position alignment system for the ultrasonic wire bonding machine

超声压焊机自动位置对准系统

Development of Control System Used in Ultrasonic Al Wire Bonding Machine

超声波铝线自动邦定机控制系统的研制

The Optimization Design of Wire Bonding Force Control System

引线键合力控制系统的优化设计

Design of welding pressure control system for ultrasonic gold wire bonding machine

超声波金丝球焊线机焊接压力控制系统设计

From the view of wire bonding, the whole procedure consists of two states: the free motion and the constrained motion.

从引线键合运动的角度来说，完整过程包括两种不同的运动状态：自由运动和约束运动。

The first step is to model the close loop control system of wire bonding force.

两步走的策略被采用：第一步，建立键合力控制系统的闭环模型；

Simulation Study of Wire Loop Profiling in IC Wire bonding

IC引线键合引线轮廓成形仿真研究

In this circumstances, we work with K & S company to develop the computerized wire bonding system.

在这种情况下我们公司和K & S公司合作开发了计算机辅助焊线系统.

Ultrasonic wire bonding is one of the most important technologies in chip interconnection of integrated circuits.

超声键合是实现集成电路封装中芯片互连的关键技术之一.

Transient Temperature Property of Ultrasonic Wire Bonding Process

超声引线键合过程的瞬态温度特性

A novel gas sensor based on micro-machined ceramic hotplate and a wire-free bonding is presented, which is aim at the shortcomings of high power consumption and difficult to package existing in the current commercial ceramic gas sensors.

针对目前商用陶瓷气体传感器功耗大、封装难的缺点，提出一种陶瓷微加工微热板式气体传感器的结构和无内引线封装的方式。

The preparation of metal bump and wire substrate have been researched, as well as flip-chip bonding technology.

对金属凸点、引线衬底的制备以及倒装焊接技术进行了研究。

solvent bonding self-fluxing enamelled wire

溶剂粘接直焊性漆包线

to eliminate the defective secondary junction caused by the deposition of additive element oxides in a high-purity gold bonding wire.

于高纯度金接合线，消除归因于添加元素氧化物的附着引起的第二次压接不良。

the interface quality of copper clad steel wire produced by liquid-solid bonding process

液-固相复合工艺对铜包钢线界面质量的影响

Application advantage of CCAW ( copper clad aluminum wire) and processing technology of clad-process welding CCAW were introduced. The effect factor of solid-state bonding during drawing the bimetal wire was analyzed.

介绍了铜包铝线的使用优点和包复焊接铜包铝线加工工艺过程，分析了通过双金属拉拔实现金属间固相结合的影响因素；

It may be collocated with automatic correction device and ultrasonic strip. bonding wire and so on.

该机可配置自动纠偏装置和超声波插条, 焊线冲孔供用户自主选择.

The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.

试验研究了不同超声功率条件下，键合时间对粗铝丝引线键合强度的影响规律。