wire bonding的例句大全

Heat bonding or solvent bonding direct welded polyurethane enameled copper round wire

热粘合或溶剂粘合直焊性聚氨酯漆包铜圆线

Fracture Analysis of Ball Bonding Gold Wire and the Way to Improve Processing Function

球焊金丝产生断裂的原因及改善加工性能的途径

The gold stud bump of good coplanarity can be manufactured on condition that the ball bonding is good and the movement of capillary keeps consistent, and it validate the feasibility of finite element simulation of capillary shearing wire.

表明若能将金球较好地焊接到基板上面且劈刀运动的方位一致，就能制作出共面性一致的钉头金凸点，验证了劈刀剪切断丝有限元模拟的正确性。

Research and Application of Copper Bonding Wire in Electronic Packaging

电子封装Cu键合丝的研究及应用

Contrast Research on the Reliability of Gold and Copper Wire/ Ball Bonding

金、铜丝球键合焊点的可靠性对比研究

Research Status of Reliability and Failure Mechanism of Ultrasonic Ball and Wedge Bonding With Copper Wire

Cu丝超声球焊及楔焊焊点可靠性及失效机理研究

Development of these work is of benefit to raising quality of gold wire ball bonding.

这些工作的开展有利于提高金丝球焊的焊接质量。

The procedure of copper wire ball bonding and its reliability in power devices were investigated.

本文研究了功率器件中铜丝球键合工艺及可靠性。

In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.

本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。

Its comprehensive coverage focuses on printed circuits, integrated circuits, contact materials, semiconductors, wire, bonding, brazing, soldering, and welding.

它的广泛报导集中在原型、激光处理、电铸层、沉淀、粉末冶金、石印术和表面精加工。

however during the fixed-orthodontic appliance bonding, gingivitis often emerges because of plaque on the brackets, bend and arch wire.

但在固定矫治中，由于托槽，带环及弓丝可以引起更多的菌斑附着，因此常出现牙龈炎症。

Study on the Technology of High Density Gold wire Ball Bonding under Normal Temperature

高密度常温金丝球焊接技术探讨

Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength

平整度对细Al丝超声引线键合强度的影响

The circuit is simulated with models of bonding wire, pad and ESD circuits.

在混频器的设计与仿真过程中，同时考虑到了压焊线、焊盘、ESD电路的影响。

Discussion of quality control of gold wire ball bonding

金丝球焊质量控制的探讨

The results from encapsulation peel tests, die and encapsulant pull tests, bonding wire pull tests and C-Mode SAM ( C-SAM) examination are presented. This paper demonstrates that the optimized plasma cleaning process would enhance PBGA package qualification level and improve the process yields and productivity.

陈述了密封剥离试验、芯片和密封剂拉力试验、焊线拉力试验和C-模式SAM（C-SAM）检查的结果，证明了最佳的等离子清洗工艺会增强PBGA封装的定性等级，并提高工艺效率和生产率。

"Rubber, vulcanized Determination of adhesion to single wire Pull out test" Gullibility: Measure of speed of paper adhesive bonding and its strength.

GB/T3513-1983橡胶与单根钢丝粘合强度的测定抽出法胶粘性能：胶粘剂对纸品的粘合速度和强度的能力。

Effect of bonding time on thick aluminum wire wedge bonding strength

键合时间对粗铝丝超声引线键合强度的影响

The content and focus of the project is based on the research and analysis of the present condition of internal and external golden bonding wire production.

我们在对国内外的键合金丝生产及研究现状进行详细分析与研究之后，确立了项目的研究内容并提出了项目的预期目标。

This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.

本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。