solder joint的例句大全

Resistance strain and temperature hysteresis loops properties of lead free solder joint

无铅焊点的电阻应变温度迟滞回线特性

The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.

该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。

Effects of thermal cycle parameters and substrate dimensions on solder joint reliability

热循环参数及基板尺寸对焊点可靠性的影响

The major failure form of solder joints is thermal fatigue and fracture damage, and the deformation behavior and response of stress is very complex due to the complicated service conditions of solder joint.

钎焊点失效的主要形式为热-机械疲劳与断裂破坏，由于焊点服役条件的复杂性，其变形行为和应力响应也十分复杂。

The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life

PBGA焊点热疲劳寿命的正交试验及回归分析

Impacts of Void Defects on Thermal Fatigue Life in Coaxial-cable Solder Joint

气孔缺陷对同轴电缆焊点热疲劳寿命影响

The Statistical Analysis and Optimal Evaluating on Thermal Fatigue Life of CCGA Based on Solder Joint Shapes

CCGA焊点热疲劳寿命统计分析与评价优化

The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package ( 2 656 circulations).

SCSP的焊点热疲劳寿命模拟值为1052个循环周，低于单芯片封装元件的焊点热疲劳寿命（2656个循环周）。

The thermal cycle dwell time, thermal cycle temperature range and the maximum dwell temperature were changed to observe their effects on the thermal fatigue life of solder joint; the length and thickness of substrate were also changed to research the dimension effect.

通过改变热循环保温时间、温度范围和最高温度，研究各参数对焊点热疲劳寿命的影响，同时也考察了基板的长度和厚度的影响。

The mismatch of thermal expansion results in an integral warpage of assemblies in the case with underfill, which decreases the shear deformation of solder joint and increases the interface stress on the chip.

填充芯下填料后的倒扣芯片连接由于胶的机械耦合作用，降低了焊点的剪切变形，但热失配引起的器件整体弯曲增强，芯片的界面应力增大。

Thermal stress analysis and fatigue life prediction for solder joint of SCSP

叠层芯片封装元件热应力分析及焊点寿命预测

Effects of Stand-off Height between Chip Component and Substrate on Lead-free Solder Joint Reliability

片式元件与基板间隙对无铅焊点可靠性的影响

Solder joint reliability is highly dependent on solder ball height uniformity/ coplanarity, so it is very important to measure the height of solder balls on chips.

BGA焊点的可靠性与芯片上焊球高度的一致性（共面度）息息相关，因此需要测量芯片上焊球的高度值。

Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

电子封装软钎焊焊点形态预测技术研究现状

Based on the calculated potential energy data for the solder joint system, the stand off height and the self alignment effects for misaligned placement were investigated.

基于焊点体系的势能数据，分析了片式元件的焊点间隙和贴片误差的自调整作用。

It is important to tailor cooling rate to improve solder joint quality.

选择合适的冷却速率可以提高焊点质量。

Analysis of solder joint position, check multilayer welding.

分析焊点位置，检查多层板焊接。

Finite Element Analysis for Flip Chip Solder Joint Reliability

倒装芯片焊点可靠性的有限元模拟法探讨

Defect Analysis and Process Improvement of BGA Solder Joint

BGA焊点的缺陷分析与工艺改进

Thermal fatigue life analysis on the PBGA Solder Joint

PBGA焊点的热疲劳寿命分析