thermal strain

This paper started a preliminary study to thermal deformation of MEMS pressure sensor by making use of digital image correlation technology, measured the thermal deformation and strain field of the surface of MEMS sensor.

利用数字图像技术对MEMS压力传感器的热变形进行了初步研究，测量了MEMS传感器表面的热变形场和应变场。

Experimental Research on the Transient Thermal Strain of High Strength Concrete at Elevated Temperature

高温时高强混凝土瞬态热应变的试验研究

At 1 000 ℃ it emerges the negative maximum free thermal strain of-0.206%.

1000℃最大自由热应变是-0.206%。

Effect of Thermal Strain on Microstructure and Mechanical Properties of Welding Heat-Affected Zone of 2090 Al-Li Alloy

热应变对2090铝锂合金焊接热影响区显微组织和力学性能的影响

It can be found from the analogous that the Thermal Strain distribution of sidewall under different conditions differs a lot.

由模拟情况得知，不同工况下侧墙的温度应变分布差异性很大。

The Affection of Thickness to Critical Thermal Strain Values about Thermal Buckling of Thin Rectangular Plates

薄板厚度对热屈曲临界温度应变值影响的数值分析

A Study on the Thermal Strain Characteristic of the Bamboo Surface

竹材表面热应变特性的研究

The deformation analysis of a one-dimensional structure of unidirectional fiber reinforced composites shows that the thermal strain depends on time intensively.

单向纤维复合材料的一维热变形分析数据显示了热应变对时间的强烈依赖关系；

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints

球栅阵列倒装焊封装中的热应变值的测试

Thermal strain and strain concentration factor can also be reduced significantly by changing the single curvature relieve slot into three curvature relieve slot.

对汽封弹性槽计算的结果表明：将原来设计的单圆弧弹性槽改为三圆弧弹性槽，热应变及热应变集中系数均可明显下降。

Distributing Measurement of Multipoint Internal Thermal Strain of 3D Braided Composite Using Fiber Bragg Grating Sensor

基于光纤光栅的编织复合材料多点热应变监测

Thermal strain analysis of a flip-chip package by a modified hybrid method

用改进的混合方法分析微电子封装热应变场

An experimental analysis of thermal strain on solid motor safe device

固体发动机保险机构在高温高压下的实验研究

Measurement of the high temperature thermal strain and its application to castable refractory

高温热应变测试技术及其在耐火浇注料上的应用

Influence of residual thermal strain on tension and compression behaviors of metal matrix composites

热残余应变对金属基复合材料拉、压性能的影响

The Thermal Strain of the Four Prestressed Steel Wires under Stress

不同应力水平下预应力钢丝的温度变形

Steam turbine, generator rotor journal wear and tear, strain of the electro-brush plating, thermal spray repair.

汽轮机 、 发电机转子轴颈磨损 、 拉伤的电刷镀 、 热喷涂修复.

Studies on oxidation resistance and thermal strain of graded nickel/ zirconia deposits

Ni/ZrO2梯度镀层高温氧化性能及热应变特性

Prediction of thermal strain in diamond-zinc sulfide composite infrared windows

金刚石-硫化锌复合窗口的弹性应变研究

Both the inner thermal strain and tension strain of the braided composites were measured successfully by the FBG sensors.

制作了含光纤布拉格光栅的编织复合材料试件并研究了光纤布拉格光栅在编织复合材料多点的内部应变检测中的应用；

It is shown that the unmatched thermal strain results in compressional stresses in the fibers, tensile stresses in the matrix, and compressional normal stresses on interfaces.

研究表明，热应变的不匹配导致纤维受压，基体受拉，界面法向受压。

Surface roughness of bamboo plywood is affected by many factors, in which thermal strain is one of the most important factors.

在竹胶合板生产中，由于多种因素的影响，竹材表面会产生一定的粗糙度，其中热应变是一个重要的因素。

The general solution for plane strain problems in decagonal quasicrystals accounting for thermal effect is derived.

推导了当考虑热效应时十次对称二维准晶体平面应变问题的通解表示.

At 1 000 ℃ the negative maximum free thermal strain is-2.34%, 13 times bigger than that in X-Y direction.

1000℃最大自由热应变是-2.34%，是X&Y向的13倍。

Analysis of Effect in the Infrared Optical Films by Thermal Strain

红外光学薄膜的热应变效应分析

Measurement of the solid rapid thermal strain induced by high intensity laser

强激光引起的固体材料的快速热应变的测量

Research on the law of thermal strain in the column of machine tools

机床立柱热变形规律的研究

Upon heating the zeolite, the normal siloxane linkage would also experience strain due to thermal expansion.

当加热沸石时,由于热膨胀作用, 正常的硅氧烷键也会存在张力.

The results show that this measurement method is available for the solid rapid thermal strain induced by a second duration laser beam.

结果表明，用温度自补偿电阻应变计方法测量秒量级强激光辐照下固体材料的快速热应变是可行的。

Whatever shapes of solder joints, under the thermal loading, the distribution of the largest equivalent Von Mises stress/ strain are all approximately same which is in the brim of solder close to the joint of solder and PCB.

研究发现，在热载荷作用下，鼓形、凹形及柱形钎料焊点的最大应力应变分布大致相同，均在钎料球的外边缘。