electronic packaging的例句大全

Chance and challenge of electronic packaging in China in 21 century

21世纪我国电子封装行业的发展机遇与挑战

Study on the Thermal Failure of Metal Substrates in Electronic Packaging

电子封装技术中金属基板结构的热失效行为研究

Current Status of Research on Electronic Packaging Materials

电子封装材料的研究现状

The Application of Several Electronic Packaging Technologies in Portable Electronics Products

几种电子封装技术在便携式电子产品中的应用

Application of the New Material in High-Density Electronic Packaging and its Prospect

浅析新材料在高密度电子封装上的应用及发展前景

With the development of electronic packaging technology, packaging pin number increasing, lead spacing smaller, encapsulated in the substrate of the area will be smaller.

随着电子封装技术的发展，封装引脚数越来越多，引线间距越来越小，封装体在基板上所占的面积也会更小。

The conversion to lead free is the trend in electronic packaging technology.

电子产品向无铅化转变是大势所趋。

Recent advances in the study of moisture absorption in plastic electronic packaging

吸收湿气对微电子塑料封装影响的研究进展

The New Generation of Green Electronic Packaging Materials

新一代绿色电子封装材料

Therefore, it is very important to investigate the reliability of electronic packaging.

因此，对电子封装可靠性的分析非常重要。

Recent achievements in research for electronic packaging substrate materials

电子封装基片材料研究进展

New Progress of Electronic Packaging Technology

电子封装技术的新进展

The present situation of lead-free system in electronic packaging

电子封装无铅化现状

Morphology of the water in plastic electronic packaging materials

电子封装塑封材料中水的形态

Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

压制压力对Si-Al电子封装材料性能的影响

Power injection molding of mo/ cu alloy for electronic packaging

电子封装用注射成形Mo/Cu合金烧结工艺的研究

Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

电子封装软钎焊焊点形态预测技术研究现状

The high reliability and low cost will lead thedevelopment of the electronic packaging.

集成电路封装的发展方向是高密度、低成本和高可靠性。

Study on Manufacturing Aluminium Matrix Composites for Electronic Packaging Using Vacuum Pressure infiltration Casting

真空压渗铸造铝基电子封装复合材料研究

Study on the Process of Cu/ Mo/ Cu Composite for Electronic Packaging

电子封装用Cu/Mo/Cu复合材料的工艺研究