electronic packaging的例句大全

Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material

退火工艺对轧制复合CPC电子封装材料性能的影响

Fundamental study of new Si-Al electronic packaging materials

新型电子封装Si-Al合金的基础研究

Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

等离子喷涂W-Cu电子封装材料的组织与性能

Preparation of high volume fraction SiCp/ Al composites for electronic packaging

电子封装用高体积分数SiCp／Al复合材料的制备

High volume fraction SiC particle reinforced aluminum matrix composites have been widely used in aviation, aerospace, electronic packaging and other fields because high stiffness, low thermal expansion coefficient and well dimensional stability.

高体积分数SiC颗粒增强铝基复合材料由于具有比铝合金和钛合金高出一倍的比刚度，低热胀系数以及尺寸稳定性，已经被广泛应用在航空、航天、电子封装等领域。

The diffusion happened between the surfaces of the Kovar/ Cu/ Kovar electronic packaging cladding sheets. The bonding mechanisms were the mechanic joggle and atomic diffusion of the interface.

Kovar／Cu／Kovar电子封装材料的界面存在少量元素扩散，界面结合由机械啮合机制以及元素扩散机制共同构成。

The thermo-physical and mechanical properties of Sip/ Al composite for electronic packaging application were studied by use of TEM observation, thermal expansion analyzer, laser thermal conduction analyzer and tensile test machine.

采用TEM观察、膨胀仪、激光导热综合测试仪以及万能电子拉伸试验机等设备及技术对复合材料进行研究。

Electronic ceramic thin tape is a kind of key materials for electronic chip components fabrication and IC packaging. They can be cast by the use of electronic ceramic slurry in a high precision tape casting machine.

电子陶瓷薄膜是片式电子元器件制造和大规模集成电路封装的关键薄膜材料，它是在高精密流延机上利用电子陶瓷浆料流延获得的。

Can be combined with sticker, air bubble sheet, etc. Suitable for electronic component, instrument packaging.

可覆合,贴纸, 气泡纸等,适用于电子元件, 仪器包装使用.

The production and application of photoresist, specialty chemicals for flat panel display, printed circuit board material, high-purity reagent, specialty gas and packaging material in China were summarized. At present, 1000 electronic chemicals can be produced in China in commercial scale or in batches.

综述了我国光刻胶、FPD专用化学品、印刷电路板材料、高纯试剂、电子特种气体和封装材料的生产和应用现状，目前我国能工业化生产或批量生产的电子化学品近1000种。

industry: feeding renewable crusher; electronic components, materials acting; injection molding; packaging tape; machine guards;

所属行业：加料再生破碎机；电子元器件、材料代理；注塑加工；包装胶带；机床护罩；；

Cao Lei said, due to the impact of electronic media, the vast majority of countries, including China, the decreasing number of news paper, and packaging and household paper increased significantly.

曹振雷说，由于受电子媒介的冲击，包括我国在内的绝大部分国家，新闻用纸数量在不断下降，而包装和生活用纸量大幅上升。

copper auto-packaging production line is large metallurgical automated packaging equipment, which combines the application of a mechanical, electronic, hydraulic, pneumatic, such as science and technology.

阴极铜自动包装生产线是大型冶金自动化包装设备，它综合应用了机械、电子、液压、气动等科学技术。

modern packaging or printing enterprises need to dispose rapidly increasing electronic documents, how to store and utilize this digital asset effectively becomes a practical problem.

现代包装印刷企业需要处理日益增多的电子文档，如何有效地存储和利用这些数字资产成为一个现实问题。

Aluminum nitride ( AIN) substrate has been recognized as one of ihe most promising electronic substrate as heating panel and packaging materials for its high thermal conductivity, fine electrical insulation, and close coefficient of thermal expansion to silicon semiconductor.

氮化铝材料具有较高的热导率和良好的介电性能，机械强度高，热膨胀系数与半导体硅材料相近，非常适于制造大功率或快速半导体器件的散热基片和封装材料。

the meaning of developing and the present situation of electronic commerce in packaging enterprises was analyzed.

结合包装业实际.分析了包装行业发展电子商务的意义,提出了发展包装电子商务的一些基本设想.

USA. PPS began to beat its way to the area of packaging of electric and electronic components which was usually dominated soly by thermosetting resins such as epoxy resin.

PPS开始跻身于以前为环氧等热固性树脂独占的电子电气元件封装领域；

major service in the electronic circuit printing, sign making, advertising and packaging printing garment enterprises.

主要服务于电子电路印刷, 标牌制作, 服装广告及包装印刷的企业.

They're photographed and cataloged, creating an electronic database of packaging technologies and ideas.

他们拍照和编目，建立一个电子数据库的包装技术和想法。

The FEA Simulation of Moisture Diffusion in Electronic Packages; Analysis on the Relation between EMC Property and Packaging Defect

塑料电子封装件中湿扩散有限元分析浅析环氧塑封料性能与器件封装缺陷